王庆仓,张晓东,苏建修,祝伟彪,郗秦阳,朱鑫,裴圣华.SiC 单晶片化学机械研磨试验研究[J].表面技术,2015,44(4):137-140,146.
WANG Qing-cang,ZHANG Xiao-dong,SU Jian-xiu,ZHU Wei-biao,XI Qin-yang,ZHU Xin,PEI Sheng-hua.Experimental Study on Chemical Mechanical Lapping of SiC Single Crystal Wafer[J].Surface Technology,2015,44(4):137-140,146 |
| SiC 单晶片化学机械研磨试验研究 |
| Experimental Study on Chemical Mechanical Lapping of SiC Single Crystal Wafer |
| 投稿时间：2014-10-28 修订日期：2015-04-20 |
| DOI：10.16490/j.cnki.issn.1001-3660.2015.04.025 |
| 中文关键词: 化学机械研磨 研磨液 碳化硅单晶片 材料去除率 表面质量 |
| 英文关键词:chemical mechanical lapping grinding liquid SiC single crystal wafer material removal rate surface quality |
| 基金项目:国家自然科学基金项目(51075125) |
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| Author | Institution |
| WANG Qing-cang | Electromechanie Engineering College, Southwest Petroleum University, Chengdu 610500, China |
| ZHANG Xiao-dong | Electromechanie Engineering College, Southwest Petroleum University, Chengdu 610500, China |
| SU Jian-xiu | Electromechanical Institute, Henan Institute of Science and Technology, Xinxiang 453003, China |
| ZHU Wei-biao | Electromechanie Engineering College, Southwest Petroleum University, Chengdu 610500, China |
| XI Qin-yang | Electromechanie Engineering College, Southwest Petroleum University, Chengdu 610500, China |
| ZHU Xin | Electromechanie Engineering College, Southwest Petroleum University, Chengdu 610500, China |
| PEI Sheng-hua | Electromechanie Engineering College, Ji'an Vocational & Technical College, Ji'an 343000, China |
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| 中文摘要: |
| 目的 提高 SiC 单晶片的材料去除率,改善加工后的表面质量。 方法 进行研磨液试验,利用极差法得到研磨液的最优配比和研磨液成分中影响去除率的主次因素顺序;对主要影响因素进行单因素试验并考察对材料去除率的影响。 结果 研磨液的质量为 50 g,最优配方为:助研剂、分散剂、增稠剂、润滑剂、磨料 A、磨料 B 的质量分别为9,7,5,3,3,5 g,其余为调和剂,磨料 A 和磨料 B 的粒度均为 W28。 结论影响材料去除率的主要因素为磨料粒度,粒度越大,材料去除率越高。 |
| 英文摘要: |
| Objective To increase the material removal rate of SiC single crystal wafer and improve the surface quality after processing. Methods Grinding fluid experiment was carried out,and the range method was used to get the optimal proportion of grinding fluid and the importance order of the influencing factors for the removal rate in the grinding fluid composition. Single factor tests were performed for the major influencing factors and their influences on the material removal rate were investigated. Results The weight of the grinding fluid was 50 g, and the optimal formula of the grinding fluid was: 9 g grind assistant agent, 7 g dispersing agent, 5 g thickening agent, 3 g lubricant, 3 g abrasive A and 5 g abrasive B, the other components were all blending agents. The particle size of abrasive A and abrasive B was both W28. Conclusion The main factor affecting the material removal rate was the particle size of abrasive. The larger the size, the higher the material removal rate. |
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