| LIU Wei,LIU Yi,WU Zhong.Effect of Additive Polarity on Structural and Mechanical Properties of Electroplated Copper[J],54(4):211-220, 232 |
| Effect of Additive Polarity on Structural and Mechanical Properties of Electroplated Copper |
| Received:April 08, 2024 Revised:April 14, 2024 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2025.04.017 |
| KeyWord:additives polarity electroplating copper mechanical property |
| Author | Institution |
| LIU Wei |
Tianjin Street Lighting Administration, Tianjin , China |
| LIU Yi |
Tianjin University, Tianjin , China |
| WU Zhong |
Tianjin University, Tianjin , China |
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| Abstract: |
| The work aims to explore the effect of organic additive molecular polarity on the microstructure and mechanical properties of electroplated copper. A series of organic additives were selected, including tetramethylammonium bromide, butyl tetramethylammonium bromide, n-octyltrimethylammonium bromide, dodecyltrimethylammonium bromide, and hexadecyltrimethylammonium bromide and then named C1, C4, C8, C12, and C16 based on the number of carbon atoms in their alkyl chains, respectively. The polarity of additive molecules was controlled by changing the length of their alkyl chains, and the regulatory mechanism of additive molecular polarity on the morphology, structure, and mechanical properties of electrodeposited copper was evaluated. The morphology of the electroplated copper layer was characterized by scanning electron microscopy (SEM), and the structure of the electroplated copper layer was analyzed by X-ray diffraction (XRD). Combined with electrochemical test methods, the deposition behavior was studied with chronopotentiometry and cathodic cyclic voltammetry. SEM characterization revealed that the introduction of organic additives significantly reduced the grain size of the copper layer, with C8 additive exhibiting excellent leveling ability, resulting in a smooth surface of the copper coating. XRD analysis indicated that the introduction of additives did not change the preferred orientation of the copper layer, and it still mainly grew preferentially along (111) crystal plane. Electrochemical tests showed that the electrostatic adsorption of organic additives on the electrode surface could form a shielding layer for copper ion reduction, thereby hindering the deposition process of copper on the cathode surface. This inhibitory effect increased with the increase of alkyl chain length in the additive, indicating a positive correlation between the additive polarity and the electrode polarization. The surface of electrodeposited copper foil obtained by introducing C8 additive was flat and exhibited the best mechanical properties. The specific values for tensile strength and surface roughness were 149.3 MPa and 1.0 μm, respectively. The polarity of organic additive molecules could be regulated by changing the length of the alkyl chain. As the alkyl chain grew, the polarity of additive molecules increased, which could refine the grain size of the electroplated copper layer and improve its mechanical properties. If the molecular polarity was too strong, it would cause uneven copper foil due to excessive cathodic polarization. Therefore, C8 additive was the optimal choice. This study provides strong technical support and practical guidance for the development of electrolytic copper foil technology. |
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