| WANG Lijuan,LIAO Juan,SONG Ning,HUANG Jian,LIU Weifei,LUO Yixin,FAN Xiaowei,TANG Yunzhi,TAN Yuhui.Preparation of Electronic Copper Foils with Low-profile and Micro-nano Surface Structures by Pulsed Method[J],53(22):202-209 |
| Preparation of Electronic Copper Foils with Low-profile and Micro-nano Surface Structures by Pulsed Method |
| Received:December 16, 2023 Revised:April 22, 2024 |
| View Full Text View/Add Comment Download reader |
| DOI：10.16490/j.cnki.issn.1001-3660.2024.22.018 |
| KeyWord:coarsening treatment copper nanoparticles ultra-low profile peel strength additives |
| Author | Institution |
| WANG Lijuan |
Chemistry and Chemical Engineering, Jiangxi University of Science and Technology, Jiangxi Ganzhou , China |
| LIAO Juan |
Chemistry and Chemical Engineering, Jiangxi University of Science and Technology, Jiangxi Ganzhou , China |
| SONG Ning |
Chemistry and Chemical Engineering, Jiangxi University of Science and Technology, Jiangxi Ganzhou , China |
| HUANG Jian |
Chemistry and Chemical Engineering, Jiangxi University of Science and Technology, Jiangxi Ganzhou , China |
| LIU Weifei |
Chemistry and Chemical Engineering, Jiangxi University of Science and Technology, Jiangxi Ganzhou , China |
| LUO Yixin |
Chemistry and Chemical Engineering, Jiangxi University of Science and Technology, Jiangxi Ganzhou , China |
| FAN Xiaowei |
Chemistry and Chemical Engineering, Jiangxi University of Science and Technology, Jiangxi Ganzhou , China |
| TANG Yunzhi |
Chemistry and Chemical Engineering, Jiangxi University of Science and Technology, Jiangxi Ganzhou , China |
| TAN Yuhui |
Chemistry and Chemical Engineering, Jiangxi University of Science and Technology, Jiangxi Ganzhou , China |
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| Abstract: |
| With the development of high-frequency and high-speed transmission, the copper foil, as one of the key the materials, is facing the challenge of a new era (low dielectric, low profile, high peeling, micro-fine copper nanoparticles structure has become the mainstream of the development of electronic copper foil). In this paper, a coarsening liquid system with compound additives was developed for the first time. Copper nanoparticles were formed on the surface of the copper foil by pulse and direct current electrodeposition. The effects of pulse duty cycle and coarsening of composite additives on the appearance of copper nanoparticles, surface roughness, and peel strength of the copper foil were characterized by scanning electron microscopy (SEM), contact angle measurement (CAM), confocal laser confocal microscopy (CLSM), and electrochemical testing. The results showed that the micro-morphology of copper nanoparticles could be controlled effectively by adjusting the pulse duty ratio. When the duty cycle was 20%, 40% and 60%, the particle size of copper nanoparticles was 74.8 nm, 73 nm and 77 nm, respectively. The difference of the microscopic morphology of nanoparticles was not obvious, and they all showed approximately spherical morphology. The Rz value of copper foil surface roughness was maintained at 0.9 μm stably, and the peel strength was 0.93 N/mm, 0.95 N/mm and 0.97 N/mm, respectively, showing a slightly increasing trend. The spheroidal nanoscale tumors with an average size of 59 nm were obtained under the condition of 80% duty cycle. At this time, the surface roughness Rz of copper foil was 0.817 nm, and the peel strength was 0.95 N/mm. It was also found that the copper nanoparticles obtained by DC coarsening showed irregular and stacked island-like morphology, and the pulsed process was more effective in reducing the particle size of the copper nanoparticles compared with DC, maintaining the homogeneity of the particle morphology of the nanoparticles, and reducing the phenomenon of particle size grading. The contact angle test showed that as the particle size of the copper tumor increased, the contact angle on the surface of the copper foil increased. The calculated surface free energy reflected the ability of the copper tumor to increase the surface area of the copper foil and improve the bonding ability with the substrate. In addition, the SEM and CLSM showed that the composite additive had a significant effect on reducing the particle size of copper nanoparticles, and the average particle size of nanoparticles was reduced from 274 nm to 77.4 nm under the same roughening process. The electrochemical tests found that the polarization curve shifted significantly in the range from −0.49-−0.39 V after the addition of composite additives, which demonstrated that the addition of composite additives significantly improved the depolarizing ability of the plating solution. In conclusion, when the pulse duty cycle is 80%, the size of the copper tumor is minimized, and the copper foil has the performance of very low profile and high peel strength at the same time. The composite additive system can effectively refine the copper tumor particles and stabilize the morphology of the copper tumor. This study is of great significance for the reduction of signal transmission loss in high-frequency and high-speed transmission. |
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