| LIU Huaiyuan,LI Jialin,WEI Longjun,MA Donglin,LENG Yongxiang.Research Progress on Microstructure and Stress Evolution Behavior of Inorganic Films[J],53(19):1-13 |
| Research Progress on Microstructure and Stress Evolution Behavior of Inorganic Films |
| Received:December 26, 2023 Revised:April 29, 2024 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2024.19.001 |
| KeyWord:s of Papers of the American Chemical Society, 2013, 245:586. |
| Author | Institution |
| LIU Huaiyuan |
College of Medicine,School of Materials Science and Engineering, Key Laboratory of Advanced Technologies of Materials, Ministry of Education, Southwest Jiaotong University, Chengdu , China |
| LI Jialin |
College of Medicine,School of Materials Science and Engineering, Key Laboratory of Advanced Technologies of Materials, Ministry of Education, Southwest Jiaotong University, Chengdu , China |
| WEI Longjun |
College of Medicine,School of Materials Science and Engineering, Key Laboratory of Advanced Technologies of Materials, Ministry of Education, Southwest Jiaotong University, Chengdu , China |
| MA Donglin |
College of Physics and Engineering, Chengdu Normal University, Chengdu , China |
| LENG Yongxiang |
College of Medicine,School of Materials Science and Engineering, Key Laboratory of Advanced Technologies of Materials, Ministry of Education, Southwest Jiaotong University, Chengdu , China |
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| Abstract: |
| Inorganic films prepared through vapor deposition technology are widely employed in various fields, including microelectronics, energy, machining, and aerospace, owing to their exceptional electrical and thermal conductivity as well as their resistance to wear and corrosion. However, the non-equilibrium thermodynamic conditions during film deposition result in a metastable state, leading to the generation of residual stress. The microstructure of these metastable films can undergo spontaneous changes in both storage and service environments, consequently altering the film properties and affecting its long-term stability. Studying the evolution patterns of as-deposited film structures in storage and service environments, as well as the corresponding behavior of residual stress and performance during natural and artificial aging, is of great significance. It contributes to film design optimization and enables accurate prediction of the lifetime of related products. The microstructural characteristics of films prepared through vapor deposition technology were reviewed and the origins of stress generation and the subsequent evolution of residual stress during inorganic film growth were introduced. The residual stress of the film was affected by the metastable state of the film after non-equilibrium growth, the difference of lattice and the coefficient of thermal expansion between the film and the substrate. Due to the lattice mismatch and the difference of coefficient of thermal expansion between the film and substrate resulting from inherent material properties, they had minimal effect on film microstructure or properties during aging. Instead, the metastable state resulting from non-equilibrium growth played a key role. Over time, under the effect of the service environment and the passage of time, the film microstructure evolved, resulting in changes in its properties and affecting its long-term stability. To enhance the long-term stability of films, it is necessary to explore the long-term evolution of the metastable structure after deposition and its effect on properties during natural and artificial aging. Natural aging occurs when inorganic films are exposed to natural environments, while artificial aging involves exposing the films to simulated service conditions or heat treatment processes. Both types of aging play important roles in understanding the microstructure and stress evolution behavior of films. Studies conducted both in China and abroad show that atomic diffusion is the primary mechanism through which film structure changes during both natural and artificial aging, directly affecting residual stress and film properties. Investigations into the microstructure and stress evolution during natural aging require substantial time for experimental observations. Natural aging and artificial aging can be combined to reduce the required experimental duration, as film stress is released through atomic diffusion during both processes. Furthermore, appropriate measures can be employed to accelerate stress relaxation during artificial aging. An effective approach to accelerate microstructural changes and stress release in inorganic films is the utilization of annealing. By carrying out annealing at temperature below the phase transition temperature of the films, atomic diffusion is facilitated without causing the formation of new phases. This technique reduces the experimental timeframe required for studying the microstructure and stress evolution during the aging process of inorganic films. In conclusion, the study of the evolution of the metastable film structure following deposition and its impact on properties during natural and artificial aging is essential for enhancing the long-term stability of films. By considering the relationship between the microstructure and stress, researchers can facilitate the design of films and predict the service life of related products. |
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