| GAO Haoyang,ZHENG Yuehong,NIU Jianan,ZHU Min,LA Peiqing,ZHU Sijia.#$NPFormation Mechanism of Micro/nanostructure of Reverse-treated Copper Foil and Its Effect on Mechanical Properties[J],53(16):219-228 |
| #$NPFormation Mechanism of Micro/nanostructure of Reverse-treated Copper Foil and Its Effect on Mechanical Properties |
| Received:September 08, 2023 Revised:January 09, 2024 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2024.16.019 |
| KeyWord:copper foil electroplate reverse treatment micro-nano structure roughness tensile properties |
| Author | Institution |
| GAO Haoyang |
School of Materials Science and Engineering Lanzhou , China;State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou , China |
| ZHENG Yuehong |
School of Materials Science and Engineering Lanzhou , China;State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou , China |
| NIU Jianan |
School of Materials Science and Engineering Lanzhou , China;State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou , China |
| ZHU Min |
School of Materials Science and Engineering Lanzhou , China;State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou , China |
| LA Peiqing |
School of Materials Science and Engineering Lanzhou , China;State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou , China |
| ZHU Sijia |
School of Materials Science and Engineering Lanzhou , China |
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| Abstract: |
| In the era of the fifth generation mobile communication technology (5G), the signal loss and even "distortion" caused by the skin effect in high-frequency high-speed signal transmission are becoming more and more serious. To overcome this problem, a new technique for treating copper foil in reverse is proposed. However, the high-performance reverse-treated copper foils (RTF) for domestic applications mainly rely on imports. In order to narrow the gap between the performance and production efficiency of domestic and foreign copper foils in a short period of time, and finally realize the localization of such high-end copper foil, the premise must be to accelerate the development and optimization of the preparation process on the basis of clear micro-nano structure formation mechanism and its effect on performance. In the present paper, electrolytic foils were deposited on the cathode titanium roller by electroplating, and subsequent treatments such as roughening and Zn plating were carried out on smooth surfaces to obtain RTFs. Then a foreign RTF was used as a reference sample, an X-ray diffractometer, a scanning electron microscope and a transmission electron microscope were used to analyze their structure in detail. Finally, a laser confocal microscope and a universal testing machine were used to measure their roughness and tensile properties. The results showed that the RTF in this work had a similar microstructure to foreign commercial products, consisting of small equiaxed crystals and larger columnar crystals, and contained a high content of nano twins. The proportion of twin boundary was 30.8% and its average width was 7.9 nm. The S plane had uniform rice shaped copper particles, while the M plane had larger conical copper nodule particles. The amorphous Zn coating on the S plane was homogeneous and dense; the thickness was about 6.5 nm. Only a small part of Zn diffused to the substrate to form CuZn3 phases. But from the S plane to the M plane, the preferred orientation gradually changed from (111)Cu to (220)Cu, which was slightly different from the reference RTF. In terms of performance, the Ra and Rz of reference RTF were 1.22 and 1.42 μm, respectively, tensile strength was 335.10 MPa and elongation was 15.5%. The RTF in this work had lower roughness, the Ra and Rz were 0.68 and 1.03 μm, respectively, and its strength also had obvious advantages (393.68 MPa), but the ductility was lower than that of the reference sample, only 6.54%. Through comparative analysis, the growth characteristics of copper foil in three stages of initial epitaxy, overgrowth and growth stage controlled by electrodeposition conditions were summarized, and the main factors affecting the grain growth of each stage were given. Then the effects of grain size and nanotwin width on tensile properties of copper foil were discussed in detail. In short, the in-depth study of the microstructure and performance of RTF facilitates the identification of the root cause of the "bottleneck" in the localization of high-performance copper foil, which can lay the foundation for the further development and application of high-performance copper foil in the 5G communication field. |
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