| YANG Kun,YAO Mengzhi,DU Jiawei,HAN Dongning,SUN Xiaolan,LI Xiaodong.Silver Plating on Stainless Steel Surface Based on Particle-free Silver Conductive Ink[J],53(16):208-218 |
| Silver Plating on Stainless Steel Surface Based on Particle-free Silver Conductive Ink |
| Received:August 25, 2023 Revised:March 12, 2024 |
| View Full Text View/Add Comment Download reader |
| DOI：10.16490/j.cnki.issn.1001-3660.2024.16.018 |
| KeyWord:stainless steel particle-free silver ink silver plating electrical conductivity adhesion |
| Author | Institution |
| YANG Kun |
Shenyang Aircraft Corporation, Shenyang , China |
| YAO Mengzhi |
School of Materials Science and Engineering, Northeastern University, Shenyang , China |
| DU Jiawei |
School of Materials Science and Engineering, Northeastern University, Shenyang , China |
| HAN Dongning |
Shenyang Aircraft Corporation, Shenyang , China |
| SUN Xiaolan |
Shenyang Aircraft Corporation, Shenyang , China |
| LI Xiaodong |
School of Materials Science and Engineering, Northeastern University, Shenyang , China |
|
| Hits: |
| Download times: |
| Abstract: |
| Stainless steel has excellent corrosion resistance and is often used in mechanical equipment. In order to improve the electrical conductivity of stainless steel, it is usually metallized on the surface. However, the traditional silver plating technology is electroplating technology, which requires the use of cyanide and other highly toxic reagents, seriously polluting the environment and human health. The particle-free silver conductive ink can be coated on various substrates to realize the application of miniaturized and highly conductive devices. Only silver precursor, solvent, and complexing agent configuration are suitable for simple operation and green environmental protection of metal layer with good bonding properties and electrical conductivity. The work aims to adopt particle-free silver conductive ink to study the silver plating on stainless steel surface, and replace the traditional silver plating technology with this green technology. The refined particle-free silver conductive ink was coated on the stainless steel substrate with the passivated film surface removed. After sintering and curing in the oven, the metal silver ions in the solution were reduced to silver particles. With the capillary force caused by liquid volatilization, the silver particles were further pulled into each other and closely connected, and the crystal nuclei grew, and uniform and dense silver films were generated in situ on the stainless steel. The surface metallization was finished to improve its electrical conductivity. Firstly, a particle-free conductive ink suitable for the surface metallization of stainless steel was prepared, and different precursor silver sources were configured by ion exchange method. Ethanol was used as solvent for complexing reaction with different complexing agents, and 0.22 μm filter was used to form a particle-free conductive ink. Secondly, the stainless steel surface was pre-treated by different methods to remove the passivation film on the stainless steel surface. Finally, the effect of the post-treatment temperature on the microstructure and properties of the silver layer on the stainless steel surface was investigated by setting different sintering and curing temperatures. The silver film on the surface of stainless steel was characterized by X-ray diffractometer, scanning electron microscope, laser confocal microscope and digital megohm meter. The results showed that after the stainless steel was treated with 1, 2-propylenediamine solution, the silver oxalate was used as the precursor, and the silver layer had the densest microstructure, the best adhesion grade (5B) and the lowest roughness (1.237 μm). When the stainless steel was complexed with 1, 2-propylenediamine, the ethanol was used as the solvent. The prepared silver layer organic compounds volatilized completely, with dense microstructure, and had the lowest contact resistance of 0.7 Ω and roughness of 0.80 μm. The silver layer had the best conductivity when the sintering and curing temperature was 200 ℃. The conclusion is that the silver layer prepared by the new process with particle-free silver conductive ink for silver plating on the surface of stainless steel has good performance, can simplify the complicated operation flow of the traditional electroplating technology, reduce the harm of the cyanide used in the traditional electroplating technology to the human body, and overcome the shortcomings of limited application. |
| Close |
|
|
|