| SUN Haijing,LIU Shuang,WANG He,CUI Jianing,ZHOU Xin,TAN Yong,SUN Jie.Zinc-nickel Alloy Electrodeposition in Choline Chloride-urea System[J],53(14):128-138 |
| Zinc-nickel Alloy Electrodeposition in Choline Chloride-urea System |
| Received:September 25, 2023 Revised:October 27, 2023 |
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| DOI：10.16490/j.cnki.issn.1001-3660.2024.14.011 |
| KeyWord:s, 2012, (38):1413. |
| Author | Institution |
| SUN Haijing |
School of Environmental and Chemical Engineering, Shenyang University of Technology, Shenyang , China |
| LIU Shuang |
School of Environmental and Chemical Engineering, Shenyang University of Technology, Shenyang , China |
| WANG He |
School of Environmental and Chemical Engineering, Shenyang University of Technology, Shenyang , China |
| CUI Jianing |
School of Environmental and Chemical Engineering, Shenyang University of Technology, Shenyang , China |
| ZHOU Xin |
School of Environmental and Chemical Engineering, Shenyang University of Technology, Shenyang , China |
| TAN Yong |
School of Environmental and Chemical Engineering, Shenyang University of Technology, Shenyang , China |
| SUN Jie |
School of Environmental and Chemical Engineering, Shenyang University of Technology, Shenyang , China |
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| Abstract: |
| Zn-Ni electrodeposition is an important metal surface treatment technology. Through reasonable control of electrochemical reaction, electrodeposition conditions and electrodeposition process control, zinc-nickel alloy plating with good corrosion resistance, good wear resistance, low hydrogen embrittlement and good weldability can be obtained. There are many reports on the research of Zn and Ni alloy, in which the Ni content also affects the corrosion resistance of Zn and Ni alloy plating. In this paper, the Zn and Ni alloy plating with high Ni content was obtained at different deposition potentials, and the electrochemical behavior of Zn and Ni alloy and the corrosion resistance of the plating alloy were studied. In eutectic solvents, the electrochemical behavior, nucleation/growth mechanism, and corrosion resistance of Zn-Ni alloy plating are also affected by differences in deposition potentials during electrodeposition. The investigation aims to examine the electrochemical properties, nucleation mechanisms, and corrosion resistance of Zn-Ni alloy in Choline chloride-Urea Deep Eutectic Solvent (ChCl-Urea DES). The research delved into the electrochemical processes underlying the formation and growth of Zn-Ni alloy through cyclic voltammetry (CV) and chronoamperometry (CA) techniques. A scanning electron microscopy (SEM) was employed to scrutinize the alloy's microstructure. Furthermore, the composition and phase structure were analyzed by energy-dispersive spectroscopy (EDS), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS). The corrosion resistance was assessed through electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization (Tafel) tests. Results indicated that Zn-Ni alloy electrodeposition in the ChCl-Urea DES system followed conventional codeposition behavior, differing from the unconventional behavior observed in aqueous solutions. The content of nickel in the deposited layer was higher than that of zinc. The nucleation mechanism of Zn-Ni alloy was determined to be three-dimensional instantaneous nucleation based on fitting and comparison of the chronoamperometry curves. SEM results revealed that the nickel content in the zinc-nickel plating decreased regularly with a negative shift in deposition potential, while the content of nickel remained higher than that of zinc throughout the deposited layer, which was consistent with the cyclic voltammetry results. XRD analysis indicated the presence of nickel in the zinc-nickel plating, with a possible small amount of zinc. XPS results confirmed the presence of zinc in the plating. Tafel and EIS tests demonstrated that the Zn-Ni alloy plating obtained at a deposition potential of –0.85 V exhibited good corrosion resistance. In conclusion, zinc-nickel alloy has experienced diffusion-controlled irreversible electrodeposition in the ChCl-urea DES system, which is different from the abnormal co-deposition in aqueous solution. In the ChCl-urea DES system, metal zinc deposition shows normal co-deposition behavior; and the content of nickel is higher than that of zinc. In the process of zinc and nickel co-deposition into zinc-nickel alloy, a three-dimensional transient nucleation mechanism occurs. The Ni content in zinc-nickel alloy plating can be regulated by controlling the deposition potential. The nickel content gradually decreases as the deposition potential moves in a more negative direction. When the deposition potential is transferred from –0.70 V to –0.85 V, the Ni content decreases when the deposition potential is further negative to –0.90 V. When the deposition potential is –0.85 V, the zinc-nickel alloy plating has significant corrosion resistance, probably due to its dense structure, fine-grain texture, and uniform surface distribution. |
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