ZONG Ao,WANG Ke-rong,PENG Kai,TANG Chao,ZHOU Da-qing,FAN Yong-jian,HOU Tian-yi,ZHU Yong-wei,LI Jun.Prediction of Residual Stress Layer Depth in Grinding Fused Quartz[J],52(12):74-82
Prediction of Residual Stress Layer Depth in Grinding Fused Quartz
Received:August 28, 2023  Revised:November 10, 2023
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DOI:10.16490/j.cnki.issn.1001-3660.2023.12.006
KeyWord:fused quartz  discrete element method  subsurface damage  crack layer  residual stress layer
                          
AuthorInstitution
ZONG Ao College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing , China
WANG Ke-rong College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing , China;Mechanical & Electrical Engineering College, Jinhua Polytechnic, Zhejiang Jinhua , China
PENG Kai The 26th Institute of China Electronics Technology Group Corporation, Chongqing , China
TANG Chao College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing , China
ZHOU Da-qing College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing , China
FAN Yong-jian College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing , China
HOU Tian-yi College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing , China
ZHU Yong-wei College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing , China
LI Jun College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing , China
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Abstract:
      Fused quartz has excellent physical and chemical properties, and is widely used in manufacture of optical components and other industries and many fields of modern science and technology. However, fused quartz glass is a high hard and brittle material. Cracks, residual stress and other damage are likely to occur during processing. The surface residual stress layer of the workpiece after grinding is under the crack layer, its position is hidden and difficult to observe. During the use of the workpiece, it is easy to expand into cracks under the action of external load, which affects the design of subsequent process parameters and the service life of the workpiece. Therefore, researching on the depth of surface residual stress layer after grinding is helpful to determine the residual processing allowance and improve the working performance of the workpiece.
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