| BAI Zi-heng,LI Xue-ming,HU Yu-ting,WANG Ji-rui,LU Lin,DONG Chao-fang,XIAO Kui.Effect of Mold on the Corrosion Behavior of PCB-Cu in Tropical Forest Environment[J],48(7):271-277 |
| Effect of Mold on the Corrosion Behavior of PCB-Cu in Tropical Forest Environment |
| Received:October 31, 2018 Revised:July 20, 2019 |
| View Full Text View/Add Comment Download reader |
| DOI：10.16490/j.cnki.issn.1001-3660.2019.07.030 |
| KeyWord:microbiologically influenced corrosion mold printed circuit boards copper electrochemical behavior |
| Author | Institution |
| BAI Zi-heng |
Corrosion and Protection Center, Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing , China |
| LI Xue-ming |
Corrosion and Protection Center, Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing , China |
| HU Yu-ting |
Corrosion and Protection Center, Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing , China |
| WANG Ji-rui |
Corrosion and Protection Center, Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing , China |
| LU Lin |
Corrosion and Protection Center, Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing , China |
| DONG Chao-fang |
Corrosion and Protection Center, Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing , China |
| XIAO Kui |
Corrosion and Protection Center, Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing , China |
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| Abstract: |
| The work aims to study the corrosion behavior of mold on PCB-Cu in tropical forest environment. Two fungi strains with the most high occurrence frequency, Fusarium solani and Daldinia eschscholtzii were selected from surfaces of PCBs via PDA culture . The dry weight method was used to study the effect of Cu2+ on biological activity. The biofilms on surface of PCB-Cu were observed by SEM and the polarization curves were adopted to investigate the electrochemical corrosion behavior. After 6 days, both fungi strains could form biofilm on PCB-Cu surface and accumulate corrosive products at mycelium concentration. At the same time, the increase of Cu2+ concentration in thin liquid membrane could inhibit the growth of bacteria. Compared with aseptic group, both strains could inhibit the increase of PCB-Cu self-corrosive potential Ecorr in the early stage and the decrease of PCB-Cu self-corrosive potential Ecorr in the later stage. After inoculation of fungal spores on PCB-Cu surface, the activity of fungi is better because the content of Cu2+ in the thin liquid film on PCB-Cu surface is lower in the initial stage, and the secretion inhibits the formation of oxide film on PCB-Cu surface, thus promoting the corrosion of PCB-Cu in the initial stage. However, with the corrosion reaction proceeding, the concentration of Cu2+ in the thin liquid film on PCB-Cu surface gradually increases, and the viability of fungi is inhibited, so the content of corrosive secretion decreases. At this time, the biofilm adhering to PCB-Cu surface protects the matrix and begins to inhibit corrosion. |
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