| TANG Nan,YANG You-hua,DENG Jing-wei,ZHOU Jian-ping,LIU Zhi-lei,LIU Guang-ming.Research on the Behavior of Dicyandiamide Modified by Bisphenol-A Type Phenolic Aldehyde Curing Epoxy Resin[J],43(6):144-148 |
| Research on the Behavior of Dicyandiamide Modified by Bisphenol-A Type Phenolic Aldehyde Curing Epoxy Resin |
| Received:June 14, 2014 Revised:December 10, 2014 |
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| DOI： |
| KeyWord:phenolic aldehyde dicyandiamide latent curing agent modification |
| Author | Institution |
| TANG Nan |
State Grid Jiangxi Electric Power Research Institute, Nanchang , China |
| YANG You-hua |
State Grid Jiangxi Electric Power Research Institute, Nanchang , China |
| DENG Jing-wei |
State Grid Jiangxi Electric Power Research Institute, Nanchang , China |
| ZHOU Jian-ping |
Nanchang Hangkong University, Nanchang , China |
| LIU Zhi-lei |
Nanchang Hangkong University, Nanchang , China |
| LIU Guang-ming |
Nanchang Hangkong University, Nanchang , China |
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| Abstract: |
| Objective To obtain a latent, low-temperature and fast curing dicyandiamide agent. Methods A new latent curing agent of dicyandiamide modified by bisphenol A type phenolic aldehyde resin was synthesized and the structure was characterized by FTIR spectra. The impact of dicyandiamide dosage on product performance was investigated. The activity of the modified curing a- gent, the dosage and the curing temperature were studied with differential scanning calorimetry (DSC). Results The results showed that the suitable molar ratio of dicyandiamide and phenolic aldehyde was 0. 6 : 1, the optimal dosage of the modified curing agent was 30% (relative to the epoxy resin mass fraction), and the constant curing temperature after modification was 127 ℃. Conclu- sions The resulting curing agent of bisphenol A phenolic resin modified dicyandiamide exhibited the best comprehensive perform- ances. |
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