| LI Li,WU Wei,ZHANG Yao-cheng.Effect of Sputtering Current on Adhesion Strength of Ti Film Deposited by Magnetron Sputtering[J],39(5):92-94 |
| Effect of Sputtering Current on Adhesion Strength of Ti Film Deposited by Magnetron Sputtering |
| Received:July 17, 2010 Revised:October 10, 2010 |
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| DOI： |
| KeyWord:Ti film magnetron sputtering sputtering current adhesion strength |
| Author | Institution |
| LI Li |
Mechatronics Department, Qiqihar Vocational School, Qiqihaer , China |
| WU Wei |
School of Material Science and Engineering, Xihua University, Chengdu , China |
| ZHANG Yao-cheng |
School of Material Science and Engineering, Shanghai Jiao Tong University, Shanghai , China |
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| Abstract: |
| The effect of sputtering current on adhesion strength of Ti film and Gd basis when the working pressure and time is constant was discussed. The adhesion strength between the film and the basis was tested by tension test, and the surface was investigated by SEM. The results show that when the sputtering current reachs 3 A, the surface of the Ti film is smooth, and the adhesion strength with the matrix is the strongest. It can be concluded that the variation of the sputtering current has prominent effect on the adhesion strength between the Ti film and the Gd. |
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