| HONG Yi,ZHANG Xiao-yan,LI Guang-yu,MA Xiao-dong,AO Qi-yan.Study on Cu-W Composite Electroplating Process[J],37(5):64-65,84 |
| Study on Cu-W Composite Electroplating Process |
| Received:July 07, 2008 Revised:October 10, 2008 |
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| DOI： |
| KeyWord:Composite electrodeposition Composite deposits Process parameter Electrical contact material Cu-W alloy |
| Author | Institution |
| HONG Yi |
School of Materials Science and Metallurgical Engineering, Guizhou University, Guiyang , China |
| ZHANG Xiao-yan |
1. School of Materials Science and Metallurgical Engineering, Guizhou University, Guiyang , China;2. Guizhou Key Laboratory for Mechanical Behavior and Microstructure of Materials, Guizhou University, Guiyang , China |
| LI Guang-yu |
School of Materials Science and Metallurgical Engineering, Guizhou University, Guiyang , China |
| MA Xiao-dong |
School of Materials Science and Metallurgical Engineering, Guizhou University, Guiyang , China |
| AO Qi-yan |
School of Materials Science and Metallurgical Engineering, Guizhou University, Guiyang , China |
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| Abstract: |
| Contact materials are demanded to have finer electric erosion resistance and anti-welding properties, but pure copper cant meet the requirement easily. The Cu-W composite deposits was formed on the surface of pure copper by composite electro deposition, to meet the service performance of contact material. The influence of W particulate content in Cu-W composite deposits including W mass concentration, current density, stimng intention and temperature on W particulate content in Cu-W composite deposits was laid special stress on, and the optimum process parameters for composite electrodeposition were determined by orthogonal experimentations. And the optimal process: W mass concentration 35 g/L, current density 4A/dm2 , stimng intention 600 r/min, the temperature of 500℃. |
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