| WEI Zhe-liang.Technology Design of Immersion Silver Plating onto Copper Substrate Based on Galvanic Current[J],36(6):81-82,96 |
| Technology Design of Immersion Silver Plating onto Copper Substrate Based on Galvanic Current |
| Received:July 24, 2007 Revised:December 10, 2007 |
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| DOI： |
| KeyWord:Immersion silver Calvanic current Displacement Ethylenediamine |
| Author | Institution |
| WEI Zhe-liang |
College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou , China |
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| Abstract: |
| The technology of immersion silver(l-Ag) plating onto copper substrate in ethylenediamine containing system was designed and optimized with galvanic current curves of Cu-Ag couple under different conditions using an advanced electrochemical station. The results show that optimal technical parameters for I-Ag can be obtained rapidly and directly, according to the shape ( appears wall-like deposition current or not) and the remainder current value on the curve of galvanic current with time. Based on the galvanic current method, a smooth and dense silver coating on copper foil can be prepared ( the silver ion concentration is 3g/L,molar ratio of silver ion and en is l: 5 , the pH value is 11. 3) . |
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