| ZHANG Ju-guo,FU Qiu-ya.Research of Silver Plating Copper Filled Conductive Adhesive[J],36(4):28-30,36 |
| Research of Silver Plating Copper Filled Conductive Adhesive |
| Received:February 15, 2007 Revised:August 10, 2007 |
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| DOI： |
| KeyWord:Conductive adhesive Link strength Electrical resistivity Silver plating copper powder |
| Author | Institution |
| ZHANG Ju-guo |
Application Sciences College, Jiangxi University of Science and Technology, Ganzhou , China |
| FU Qiu-ya |
Material and Chemical Engineering College, Jiangxi University of Science and Technology, Ganzhou , China |
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| Abstract: |
| A micro-flake 2-8 μm copper powder was obtained by grinding commercial copper powder. With several electroless silver plating treatments to the micro-flake copper powder, a high performance copper powder covered with more than 900-/o surface with silver was obtained. A kind of conductive adhesive consists of above copper powder, epoxy resin, curing agent and other additives was synthesized, which can prevent copper powders oxidation effectively. In addition, it has a stable resistance and electric resistance rate can attain 10-4Ω.cm. Compared with silver conductive adhesive, it has lower cost and better to bear shear and heat aging. The experiment data is link strength of conductive adhesives；12MPa. Electrical resistivity is 4. 8 xl0-4Ω.cm. The anti-oxidization is more higher at 1300C . |
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