XU Hui,WANG Gui fang,LUAN Feng-hu,HU Sheng-peng.Study on Low Cost Chemistry Modification on ( SiC) p[J],36(2):21-23
Study on Low Cost Chemistry Modification on ( SiC) p
Received:October 27, 2006  Revised:April 10, 2007
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KeyWord:( SiC)p  ( Ni/SiC)p  Surface modification  Electroless plating  Heat treatment
           
AuthorInstitution
XU Hui Department of Materials and Chemistry Engineering, Heilongjiang Engineering Institute, Harbin , China
WANG Gui fang Department of Materials Science and Engineering, Harbin Engineering University, Harbin , China
LUAN Feng-hu Department of Materials Science and Engineering, Harbin Engineering University, Harbin , China
HU Sheng-peng Department of Materials and Chemistry Engineering, Heilongjiang Engineering Institute, Harbin , China
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Abstract:
      For solving shortage of naked ( SiC)p in the application, the surface low cost chemistry modification on ( SiC) p was expound. The simple electroless plating improved the pre-treatments technology including oxidation, ge- ting close to water, sensitization and activation process. The continual, non-lubricous and high quality decoration of ( SiC)p( abbreviate as ( Ni/SiC)p) was obtained. Experiment results of SEM, EDS, XRD and TEM indicate that the e- lectric functions of ( Ni/SiC) p is much higher than those of unembellished ( SiC)p, and morphology and structure of ( Ni/SiC)p are changed. The effect of heat treatment on ( Ni/SiC)p was also analyzed. The result expresses that along with the temperature, the non-crystalline state nickel in surface modified layer on ( Ni/SiC) p becomes crystalline state nickel along with the going up of temperature.
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