刘伟,刘怡,吴忠.添加剂极性对电镀铜结构及力学性能的影响[J].表面技术,2025,54(4):211-220, 232.
LIU Wei,LIU Yi,WU Zhong.Effect of Additive Polarity on Structural and Mechanical Properties of Electroplated Copper[J].Surface Technology,2025,54(4):211-220, 232 |
| 添加剂极性对电镀铜结构及力学性能的影响 |
| Effect of Additive Polarity on Structural and Mechanical Properties of Electroplated Copper |
| 投稿时间：2024-04-08 修订日期：2024-04-14 |
| DOI：10.16490/j.cnki.issn.1001-3660.2025.04.017 |
| 中文关键词: 添加剂 极性 电镀 铜 力学性能 |
| 英文关键词:additives polarity electroplating copper mechanical property |
| 基金项目:国家自然科学基金项目(52371072，52171078) |
|
|
|
|
| 摘要点击次数: |
| 全文下载次数: |
| 中文摘要: |
| 目的 旨在探讨有机添加剂分子极性对电镀铜微观结构及其力学性能的影响规律。方法 选择了一系列有机添加剂，分别为四甲基溴化铵、丁基四甲基溴化铵、正辛基三甲基溴化铵、十二烷基三甲基溴化铵和十六烷基三甲基溴化铵，并根据其烷基链中的碳原子数分别命名为C1、C4、C8、C12和C16，通过改变其烷基链长度来调控添加剂分子极性，评价添加剂分子极性对电沉积铜形貌、结构及力学性能的调控机制，并通过扫描电子显微镜(SEM)表征电镀铜层的形貌，利用X射线衍射(XRD)分析电镀铜层的结构，结合电化学测试方法(计时电位法和阴极循环伏安法)研究其沉积行为。结果 SEM表征结果表明，有机添加剂的引入明显减小了铜层的晶粒尺寸，其中C8添加剂表现出卓越的整平能力，使铜镀层表面光滑。XRD分析表明添加剂的引入并没有改变铜层的择优取向，仍主要沿(111)晶面优先生长。电化学测试表明，有机添加剂在电极表面的静电吸附能够形成铜离子还原的屏蔽层，从而阻碍铜在阴极表面的沉积过程。这种阻碍作用随着添加剂中烷基链长的增加而增强，表明添加剂极性的增加与电极极化的增加之间存在正相关。引入C8添加剂获得的电沉积铜箔表面平整，力学性能最佳，拉伸强度和表面粗糙度分别为149.3 MPa和1.0 μm。结论 通过改变烷基链长度可以调控有机添加剂分子极性，随着烷基链增长，添加剂分子极性增强，可以细化电镀铜层晶粒，提高铜层力学性能，但分子极性过强则会导致阴极极化过大使铜箔不均匀，因此C8添加剂是最优选择。为电解铜箔技术的发展提供了有力的技术支撑和实践指导。 |
| 英文摘要: |
| The work aims to explore the effect of organic additive molecular polarity on the microstructure and mechanical properties of electroplated copper. A series of organic additives were selected, including tetramethylammonium bromide, butyl tetramethylammonium bromide, n-octyltrimethylammonium bromide, dodecyltrimethylammonium bromide, and hexadecyltrimethylammonium bromide and then named C1, C4, C8, C12, and C16 based on the number of carbon atoms in their alkyl chains, respectively. The polarity of additive molecules was controlled by changing the length of their alkyl chains, and the regulatory mechanism of additive molecular polarity on the morphology, structure, and mechanical properties of electrodeposited copper was evaluated. The morphology of the electroplated copper layer was characterized by scanning electron microscopy (SEM), and the structure of the electroplated copper layer was analyzed by X-ray diffraction (XRD). Combined with electrochemical test methods, the deposition behavior was studied with chronopotentiometry and cathodic cyclic voltammetry. SEM characterization revealed that the introduction of organic additives significantly reduced the grain size of the copper layer, with C8 additive exhibiting excellent leveling ability, resulting in a smooth surface of the copper coating. XRD analysis indicated that the introduction of additives did not change the preferred orientation of the copper layer, and it still mainly grew preferentially along (111) crystal plane. Electrochemical tests showed that the electrostatic adsorption of organic additives on the electrode surface could form a shielding layer for copper ion reduction, thereby hindering the deposition process of copper on the cathode surface. This inhibitory effect increased with the increase of alkyl chain length in the additive, indicating a positive correlation between the additive polarity and the electrode polarization. The surface of electrodeposited copper foil obtained by introducing C8 additive was flat and exhibited the best mechanical properties. The specific values for tensile strength and surface roughness were 149.3 MPa and 1.0 μm, respectively. The polarity of organic additive molecules could be regulated by changing the length of the alkyl chain. As the alkyl chain grew, the polarity of additive molecules increased, which could refine the grain size of the electroplated copper layer and improve its mechanical properties. If the molecular polarity was too strong, it would cause uneven copper foil due to excessive cathodic polarization. Therefore, C8 additive was the optimal choice. This study provides strong technical support and practical guidance for the development of electrolytic copper foil technology. |
| 查看全文 查看/发表评论 下载PDF阅读器 |
| 关闭 |
|
|
|
渝公网安备 50010702501715号