李玉珠,曾晓彤,刘洪亮,赵方超,方博,刘杰.盐雾环境中不同表面处理印制电路板(PCB)的腐蚀行为[J].表面技术,2025,54(4):96-109.
LI Yuzhu,ZENG Xiaotong,LIU Hongliang,ZHAO Fangchao,FANG Bo,LIU Jie.Corrosion Failure Behavior of Printed Circuit Board (PCB) with Different Treated Surfaces in Salt Spray Environment[J].Surface Technology,2025,54(4):96-109 |
| 盐雾环境中不同表面处理印制电路板(PCB)的腐蚀行为 |
| Corrosion Failure Behavior of Printed Circuit Board (PCB) with Different Treated Surfaces in Salt Spray Environment |
| 投稿时间：2024-09-03 修订日期：2024-11-06 |
| DOI：10.16490/j.cnki.issn.1001-3660.2025.04.007 |
| 中文关键词: 印制电路板 盐雾试验 极化曲线 失效行为 电化学迁移 |
| 英文关键词:printed circuit board salt spray test polarization curve failure behavior electrochemical migration |
| 基金项目:山东省泰山学者工程(tsqn202306160);烟台先进材料与绿色制造山东省实验室开放课题(AMGM2024F03);西南技术工程研究所合作基金项目(HDHDW59CZ) |
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| Author | Institution |
| LI Yuzhu | School of Chemistry and Chemical Engineering, Yantai University, Shandong Yantai 264005, China |
| ZENG Xiaotong | School of Chemistry and Chemical Engineering, Yantai University, Shandong Yantai 264005, China |
| LIU Hongliang | School of Chemistry and Chemical Engineering, Yantai University, Shandong Yantai 264005, China;Shandong Laboratory of Yantai Advanced Materials and Green Manufacturing, Shandong Yantai 264006, China |
| ZHAO Fangchao | Weathering Test and Research Center of Science Technology and Industry for National Defense, Southwest Technology and Engineering Research Institute, Chongqing 400039, China |
| FANG Bo | School of Chemistry and Chemical Engineering, Yantai University, Shandong Yantai 264005, China |
| LIU Jie | School of Chemistry and Chemical Engineering, Yantai University, Shandong Yantai 264005, China |
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| 中文摘要: |
| 目的 探究覆铜板(PCB-Cu)、浸银印制电路板(PCB-ImAg)和浸锡印制电路板(PCB-ImSn)在盐雾环境下的腐蚀失效行为和机理。方法 开展PCB-Cu、PCB-ImAg、PCB-ImSn的中性盐雾试验，从电化学阻抗谱、极化曲线、表面腐蚀形貌及腐蚀产物成分等方面研究PCB在盐雾环境下的腐蚀失效机理。结果 盐雾试验进行至168 h时，PCB-Cu阻抗值由试验前5.20×103 Ω∙cm2增大至2.07×104 Ω∙cm2，自腐蚀电流密度由1.454 µA/cm2降至0.036 µA/cm2，腐蚀产物(Cu2O、Cu2Cl(OH)3)在一定程度上阻碍了腐蚀性粒子的传输;PCB-ImAg阻抗值由试验前5.13×103 Ω∙cm2增大至1.13×104 Ω∙cm2，自腐蚀电流密度由0.759 µA/cm2增大至2.179 µA/cm2，浸Ag层发生破损，暴露出Cu基体，导致Cu基体腐蚀速率增大;PCB-ImSn阻抗值由试验前1.72×105 Ω∙cm2降至1.35×105 Ω∙cm2，自腐蚀电流密度由0.016 µA/cm2增大至0.069 µA/cm2，此过程中腐蚀产物逐渐积累，延缓了腐蚀进程。施加电压后，PCB阳极腐蚀严重，PCB-ImSn和PCB-Cu阴极边缘出现腐蚀产物向阳极生长的现象。结论 随着盐雾试验时间的延长，PCB-Cu表面腐蚀产物不断积累，PCB-ImSn表面形成致密的腐蚀产物层，PCB-ImAg表面形成大阴极小阳极的电偶体系，Cu基体腐蚀加剧。此外，3种PCB样品阳极区域均出现Cu元素的富集现象。PCB-ImSn的电化学迁移敏感性较高，PCB-ImAg的电化学迁移敏感性相对较低。 |
| 英文摘要: |
| The surface of printed circuit board (PCB) is prone to electrochemical corrosion due to the synergistic effect of environmental factors. As one of the common pollutants, Cl− is more likely to adsorb on the metal surface and penetrate into the metal substrate, thus causing serious damage to the metal substrate. In this experiment, the corrosion failure behaviors and mechanisms of copper clad laminate (PCB-Cu), silver-immersed printed circuit board (PCB-ImAg) and tin−immersed printed circuit board (PCB-ImSn) in salt spray environment were investigated. The neutral salt spray test was carried out to PCB-Cu, PCB-ImAg and PCB-ImSn. The corrosion failure mechanism of PCB in salt spray environment was analyzed from the aspects of electrochemical impedance spectroscopy (EIS), polarization curve, surface corrosion morphology and composition of corrosion products. In the neutral salt spray environment, after 168 h of the salt spray test, the impedance value of PCB-Cu increased from 5.20×103 Ω∙cm2 to 2.07×104 Ω∙cm2, while the reciprocal of charge transfer resistance gradually decreased. Concurrently, the self-corrosion current density decreased from 1.454 µA/cm2 to 0.036 µA/cm2. The corrosion products, mainly composed of Cu2O and Cu2Cl(OH)3, accumulated on the surface of PCB-Cu, which hindered the transmission of corrosive particles to a certain extent. The impedance value of PCB-ImAg increased from 5.13×103 Ω∙cm2 to 1.13×104 Ω∙cm2, with a corresponding increase in self-corrosion current density from 0.759 µA/cm2 to 2.179 µA/cm2. The Ag layer was gradually damaged, and the corrosive particles accumulated on the surface of exposed Cu substrate, weakening the protective effect of the corrosion product layer, thereby intensifying corrosion. At this time, corrosion products such as Cu2O, Cu2Cl(OH)3 and Ag2O were gradually formed and accumulated continuously, delaying the corrosion to a certain extent. Conversely, for PCB-ImSn, the impedance value was reduced from 1.72×105 Ω∙cm2 to 1.35×105 Ω∙cm2, while the reciprocal of charge transfer resistance increased slightly, and the self-corrosion current density increased from 0.016 µA/cm2 to 0.069 µA/cm2. With the extension of salt spray test time, the corrosion products gradually accumulated, and a dense layer of corrosion products formed on the surface, playing a role in delaying corrosion. After the voltage was applied, the anode of PCB was seriously corroded, while the corrosion products on the cathode edge of PCB-ImSn and PCB-Cu grew towards the anode. The results indicated that with the prolonged exposure to salt spray test, the corrosion products on the surface of PCB-Cu accumulated continuously, and the corrosion product layer gradually thickened, thereby delaying corrosion. The corrosion products on the surface of PCB-ImSn gradually dissolved and became thinner and more stable and dense corrosion product layers gradually formed. However, the surface of PCB-ImAg was gradually damaged, exposing the Cu substrate and forming a galvanic system with large cathode and small anode, which led to the increase of corrosion rate of Cu substrate, and the protective effect of corrosion products was weakened. Moreover, the enrichment phenomenon of Cu appeared in anode region of the three PCB samples. The electrochemical migration sensitivity of PCB-ImSn was high, while the electrochemical migration sensitivity of PCB-ImAg was relatively low. |
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