张泽,张远涛,张林,赵栋才,张腾飞,张世宏.电弧离子镀涂层大颗粒缺陷控制与抑制技术研究进展[J].表面技术,2025,54(1):1-16.
ZHANG Ze,ZHANG Yuantao,ZHANG Lin,ZHAO Dongcai,ZHANG Tengfei,ZHANG Shihong.Research Progress of Large Particle Defect Removal inArc Ion Plating Coatings[J].Surface Technology,2025,54(1):1-16 |
| 电弧离子镀涂层大颗粒缺陷控制与抑制技术研究进展 |
| Research Progress of Large Particle Defect Removal inArc Ion Plating Coatings |
| 投稿时间：2024-08-23 修订日期：2024-10-17 |
| DOI：10.16490/j.cnki.issn.1001-3660.2025.01.001 |
| 中文关键词: 电弧离子镀 大颗粒去除 电弧源 磁过滤 工艺参数 |
| 英文关键词:arc ion plating large particle removal arc source magnetic filtration processing parameters |
| 基金项目:国家重点研发计划重点专项(2023YFB3812700);广东省自然科学基金(2023A1515010042) |
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| Author | Institution |
| ZHANG Ze | Key Laboratory of Green Fabrication and Surface Technology of Advanced Metal Materials, Ministry of Education,Anhui University of Technology, Anhui Maanshan 243002, China |
| ZHANG Yuantao | Key Laboratory of Green Fabrication and Surface Technology of Advanced Metal Materials, Ministry of Education,Anhui University of Technology, Anhui Maanshan 243002, China |
| ZHANG Lin | Key Laboratory of Green Fabrication and Surface Technology of Advanced Metal Materials, Ministry of Education,Anhui University of Technology, Anhui Maanshan 243002, China |
| ZHAO Dongcai | Key Laboratory of Green Fabrication and Surface Technology of Advanced Metal Materials, Ministry of Education,Anhui University of Technology, Anhui Maanshan 243002, China |
| ZHANG Tengfei | Key Laboratory of Green Fabrication and Surface Technology of Advanced Metal Materials, Ministry of Education,Anhui University of Technology, Anhui Maanshan 243002, China |
| ZHANG Shihong | Key Laboratory of Green Fabrication and Surface Technology of Advanced Metal Materials, Ministry of Education,Anhui University of Technology, Anhui Maanshan 243002, China |
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| 中文摘要: |
| 电弧离子镀是当前应用最广泛的物理气相沉积技术，其制备的涂层具备高硬度、高沉积效率和良好的结合力等优点，在刀具及模具涂层领域展现出显著优势。然而，该技术存在涂层表面大颗粒缺陷的问题，严重限制了其在高精密加工、高致密性防护涂层以及传感器绝缘膜等领域的推广应用。因此，如何有效减少涂层表面大颗粒缺陷的数量和密度已成为相关机构关注的重要研究方向之一。总结了电弧离子镀技术在大颗粒缺陷控制和抑制方面的最新进展和应用，探讨了当前存在的问题及解决方案。对大颗粒产生、传输和到达3个阶段下的产生/运动机理和控制手段进行了总结。针对大颗粒产生过程，通过优化弧源设计，改善磁场分布，提高弧斑运动速度，实现了更加均匀、快速的弧斑运动轨迹，减少了大颗粒生成概率;在传输过程中，采用物理屏蔽/磁过滤与辅助阳极辅助等手段有效控制了离子和大颗粒运动轨迹;在基体区域沉积阶段，通过增加基体偏压来调控到达基体的大颗粒数目。此外沉积参数的改变也广泛用于减少大颗粒缺陷。这些方法思路和研究进展将为解决电弧离子镀技术中存在的大颗粒缺陷问题提供新思路，并有望推动该项技术在各个行业中得到更广泛的应用。 |
| 英文摘要: |
| Arc ion plating (AIP) is a widely used physical vapor deposition (PVD) technique for producing coatings with high hardness, high deposition efficiency, high corrosion resistance, and good adhesion strength with the substrate, and these coatings find significant applications in various fields, including cutting tools and molds. However, large particle defects on the coating surface limit its application in high-precision industries such as precision processing, high-density protective coatings, sensor insulating films, etc. During the operation in harsh environments such at elevated temperature or under corrosive media, the large particle defects often act as nucleation sites for corrosion attack. The corrosive media penetrate the coating through these defects and reach the substrate, leading to a catastrophic failure of the coating. Therefore, minimizing the content of such large particle defects on the coating surface in arc ion plating technology has become an important aspect of advancing arc ion plating technology. In recent years, relevant institutions and researchers have focused on understanding and mitigating large particle defects in arc ion plating technology and have made significant progress in this field. This review explored recent advancements and practical implementation of arc ion plating technology for controlling large particle defects and discussed the current problems and solutions of arc ion plating technology. Understanding the mechanisms of large particle formation, transmission, and deposition into the substrate was crucial for developing effective control strategies. A detailed review of the suppression methods and approaches employed by various researchers at each of the three stages was conducted to understand their application and effectiveness thoroughly. Large particles originated from droplets spattered from the target surface during the arcing process. Researchers achieved more uniform and rapid arc spot movement trajectories by optimizing the arc source design, improving the magnetic field distribution, and increasing the arc spot movement speed. These enhancements ultimately reduced the distribution density and the number of large particles. Large particles were transported through the plasma and influenced by electric and magnetic fields. Therefore, physical shielding, magnetic filtration, and auxiliary anode assistance were employed to manipulate the trajectories of ions and large particles. These methods reduced the probability of large particles reaching the substrate or coating surface. Large particles that reached the substrate could cause defects on the coating surface, impacting its quality and performance. Applying a negative bias to the substrate could repel large particles, preventing their deposition. In addition, substrate material and surface condition could also influence the adhesion of large particles and their impacts on the coating. Other factors influencing large particle defects included target arc current, chamber pressure, reaction gas type, deposition temperature, and deposition time. These parameters could be adjusted to reduce defects efficiently and at low cost. In summary, controlling large particle defects in AIP is essential for producing high-quality coatings. By understanding the mechanisms involved and implementing effective control strategies, researchers have made significant progress in reducing defect levels. Future advancements in technology and research will continue to drive improvements in AIP processes and expand its applications. In the future, efforts to reduce large particle defects in arc ion plating should focus on precise control of the target magnetic field strength and distribution to minimize droplet spattering at the source using dynamic magnetic fields, exploring optimal magnetic filtration arrangements and bias magnetic field distributions to balance coating deposition efficiency and quality, and adopting new substrate biasing technologies such as short pulse and magnetic biasing to nearly eliminate large particle defects before they reach the substrate. |
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