叶志鹏,邵志松,黄文涛,王锟.L-半胱氨酸处理铜基吸液芯亲水工艺与机理研究[J].表面技术,2024,53(22):191-201.
YE Zhipeng,SHAO Zhisong,HUANG Wentao,WANG Kun.Improving the Hydrophilicity of Copper-based Surfaces through L-Cysteine Treatment[J].Surface Technology,2024,53(22):191-201 |
| L-半胱氨酸处理铜基吸液芯亲水工艺与机理研究 |
| Improving the Hydrophilicity of Copper-based Surfaces through L-Cysteine Treatment |
| 投稿时间：2023-12-14 修订日期：2024-07-12 |
| DOI：10.16490/j.cnki.issn.1001-3660.2024.22.017 |
| 中文关键词: 表面改性 吸液芯 超亲水 均热板 L-半胱氨酸 传热性能 |
| 英文关键词:surface modification absorbent core super-hydrophilic homogeneous plate L-cysteine heat transfer performance |
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| 中文摘要: |
| 目的 研究L-半胱氨酸浸渍处理工艺对铜基表面亲水性能的影响，并采用获得的最优工艺处理吸液芯来实现表面改性，提高吸液芯毛细能力，从而优化均热板的传热效率。方法 设置温度、时间、浓度进行三因素五水平正交实验;利用接触角测量仪测定测试样品与水之间的接触角;使用相同时间内水在吸液芯层垂直爬升高度来表征毛细攀升能力;用扫描电子显微镜(SEM)观察处理前后吸液芯微观形貌，用能谱仪(EDS)研究吸液芯处理前后表面元素变化情况，用X射线光电子能谱(XPS)研究处理前后吸液芯表面元素价态变化，用测温平台测量处理前后吸液芯制成的均热板热阻。结果 正交实验反映了浓度、时间、温度对处理后的铜板与水的接触角影响力，浓度最高，温度最低;L-半胱氨酸处理后的吸液芯毛细能力提高了约40%;吸液芯处理前后的微观形貌发生显著变化;XPS显示S峰结合能向低结合能方向发生偏移，部分铜由1价转化成2价;处理后的试样在相同功率条件下，与处理前相比，在传热效率方面表现出显著的温差优势，其极限传热功率提升约200 W。结论 L-半胱氨酸浸渍处理铜基能明显提高铜表面亲水性，使用最佳工艺能够提高均热板吸液芯的毛细能力，从而提高均热板的传热性能。 |
| 英文摘要: |
| This study investigates the impact of L-Cysteine impregnation process on the wettability of copper surfaces, and applies the optimal process obtained to achieve surface modification of absorbent cores. This enhances the capillary ability of the absorbent cores, thereby optimizing heat transfer efficiency of a homogeneous plate. A three-factor five-level orthogonal impregnation experiment was conducted with temperature, time, and concentration as variables. The contact angle between the sample surface and water was measured with a contact angle measurement instrument. The capillary climbing height of water in the liquid absorption core layer was used to characterize the capillary climbing ability. A scanning electron microscopy (SEM) was used to observe the microstructure of the liquid absorption core before and after treatment. An energy dispersive spectrometry (EDS) was used to study the surface element changes of the liquid absorption core before and after treatment. An X-ray photoelectron spectroscopy (XPS) was used to study the changes in the valence states of surface elements of the liquid absorption core before and after treatment. The thermal resistance of the heat plate made from the liquid absorption core before and after L-cysteine impregnation was measured with a temperature measurement platform. The range analysis of the orthogonal experiment showed that the concentration, time, and temperature had different effects on the contact angle between the treated copper plate and water, from high to low. The contact angle decreased from 90° to 7°, indicating superhydrophilicity. The optimal process for obtaining the smallest contact angle of the copper sample was found to be reaction at L-cysteine concentration of 0.1 g/L at 50 ℃ for 90 minutes. The liquid absorption core treated with L-cysteine showed a significant increase in the capillary climbing height of water within 20 seconds, with an improvement in capillary ability of about 40%. The microstructure of the liquid absorption core before and after treatment changed significantly, and flocculent substances could be clearly observed on the dendritic structure surface at 20 000 times magnification. Elemental analysis of the flocculent substances revealed the presence of sulfur (S) elements, with atomic percentages of 1.72%, respectively. XPS showed a shift of the S peak binding energy towards lower binding energy, and some copper was converted from monovalent to divalent, indicating electron transfer between S and Cu and the formation of chemical bond structure between the L-cysteine thiol group and the copper surface. In terms of heat transfer efficiency, the sample treated with L-cysteine showed a temperature difference advantage of obvious compared with that before treatment at the same power, and the maximum heat transfer power was increased by about 200 W. In conclusion, L-cysteine impregnation treatment can significantly improve the hydrophilicity of copper surfaces, and using the optimal process can improve the capillary ability of the heat plate liquid absorption core, thereby improving the heat transfer performance of the heat plate. |
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