刘怀远,李佳临,魏龙君,马东林,冷永祥.无机薄膜组织结构及应力演化行为研究现状[J].表面技术,2024,53(19):1-13.
LIU Huaiyuan,LI Jialin,WEI Longjun,MA Donglin,LENG Yongxiang.Research Progress on Microstructure and Stress Evolution Behavior of Inorganic Films[J].Surface Technology,2024,53(19):1-13 |
| 无机薄膜组织结构及应力演化行为研究现状 |
| Research Progress on Microstructure and Stress Evolution Behavior of Inorganic Films |
| 投稿时间：2023-12-26 修订日期：2024-04-29 |
| DOI：10.16490/j.cnki.issn.1001-3660.2024.19.001 |
| 中文关键词: 无机薄膜 物理气相沉积技术 时效 应力演化 稳定性 |
| 英文关键词:s of Papers of the American Chemical Society, 2013, 245:586. |
| 基金项目:国家自然科学基金(52072312) |
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| Author | Institution |
| LIU Huaiyuan | College of Medicine,School of Materials Science and Engineering, Key Laboratory of Advanced Technologies of Materials, Ministry of Education, Southwest Jiaotong University, Chengdu 610031, China |
| LI Jialin | College of Medicine,School of Materials Science and Engineering, Key Laboratory of Advanced Technologies of Materials, Ministry of Education, Southwest Jiaotong University, Chengdu 610031, China |
| WEI Longjun | College of Medicine,School of Materials Science and Engineering, Key Laboratory of Advanced Technologies of Materials, Ministry of Education, Southwest Jiaotong University, Chengdu 610031, China |
| MA Donglin | College of Physics and Engineering, Chengdu Normal University, Chengdu 611130, China |
| LENG Yongxiang | College of Medicine,School of Materials Science and Engineering, Key Laboratory of Advanced Technologies of Materials, Ministry of Education, Southwest Jiaotong University, Chengdu 610031, China |
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| 中文摘要: |
| 物理气相沉积技术制备的无机薄膜，其组织结构及残余应力会在储存或服役环境中自发地产生演化，进而使薄膜性能发生变化，最终影响薄膜的长期服役稳定性。首先从物理气相沉积技术制备薄膜的组织结构特征入手，介绍了无机薄膜应力的产生，发现薄膜的残余应力主要受薄膜非平衡生长后的亚稳态、薄膜与基体之间的晶格错配以及热膨胀系数差异的影响。之后论述了无机薄膜在生长过程中应力的演化规律，这个规律主要受薄膜的制备工艺影响，包括沉积速率、沉积气压、沉积温度以及基体偏压等。随后，重点综述了非平衡生长后的亚稳态金属薄膜、陶瓷薄膜及金属/陶瓷复合薄膜的组织结构、残余应力在储存或服役环境中的演化，以及薄膜性能变化行为的研究进展。针对无机薄膜在自然时效及人工时效过程中，其组织结构演变与应力释放的关系进行了总结和讨论，发现原子扩散是自然时效及人工时效过程中薄膜产生变化的主要途径。最后，对无机薄膜组织结构及应力演化行为的研究方法进行了展望。 |
| 英文摘要: |
| Inorganic films prepared through vapor deposition technology are widely employed in various fields, including microelectronics, energy, machining, and aerospace, owing to their exceptional electrical and thermal conductivity as well as their resistance to wear and corrosion. However, the non-equilibrium thermodynamic conditions during film deposition result in a metastable state, leading to the generation of residual stress. The microstructure of these metastable films can undergo spontaneous changes in both storage and service environments, consequently altering the film properties and affecting its long-term stability. Studying the evolution patterns of as-deposited film structures in storage and service environments, as well as the corresponding behavior of residual stress and performance during natural and artificial aging, is of great significance. It contributes to film design optimization and enables accurate prediction of the lifetime of related products. The microstructural characteristics of films prepared through vapor deposition technology were reviewed and the origins of stress generation and the subsequent evolution of residual stress during inorganic film growth were introduced. The residual stress of the film was affected by the metastable state of the film after non-equilibrium growth, the difference of lattice and the coefficient of thermal expansion between the film and the substrate. Due to the lattice mismatch and the difference of coefficient of thermal expansion between the film and substrate resulting from inherent material properties, they had minimal effect on film microstructure or properties during aging. Instead, the metastable state resulting from non-equilibrium growth played a key role. Over time, under the effect of the service environment and the passage of time, the film microstructure evolved, resulting in changes in its properties and affecting its long-term stability. To enhance the long-term stability of films, it is necessary to explore the long-term evolution of the metastable structure after deposition and its effect on properties during natural and artificial aging. Natural aging occurs when inorganic films are exposed to natural environments, while artificial aging involves exposing the films to simulated service conditions or heat treatment processes. Both types of aging play important roles in understanding the microstructure and stress evolution behavior of films. Studies conducted both in China and abroad show that atomic diffusion is the primary mechanism through which film structure changes during both natural and artificial aging, directly affecting residual stress and film properties. Investigations into the microstructure and stress evolution during natural aging require substantial time for experimental observations. Natural aging and artificial aging can be combined to reduce the required experimental duration, as film stress is released through atomic diffusion during both processes. Furthermore, appropriate measures can be employed to accelerate stress relaxation during artificial aging. An effective approach to accelerate microstructural changes and stress release in inorganic films is the utilization of annealing. By carrying out annealing at temperature below the phase transition temperature of the films, atomic diffusion is facilitated without causing the formation of new phases. This technique reduces the experimental timeframe required for studying the microstructure and stress evolution during the aging process of inorganic films. In conclusion, the study of the evolution of the metastable film structure following deposition and its impact on properties during natural and artificial aging is essential for enhancing the long-term stability of films. By considering the relationship between the microstructure and stress, researchers can facilitate the design of films and predict the service life of related products. |
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