高颢洋,郑月红,牛嘉楠,朱敏,喇培清,祝思佳.反向处理铜箔微纳组织形成机理及其对力学性能的作用机制[J].表面技术,2024,53(16):219-228.
GAO Haoyang,ZHENG Yuehong,NIU Jianan,ZHU Min,LA Peiqing,ZHU Sijia.#$NPFormation Mechanism of Micro/nanostructure of Reverse-treated Copper Foil and Its Effect on Mechanical Properties[J].Surface Technology,2024,53(16):219-228 |
| 反向处理铜箔微纳组织形成机理及其对力学性能的作用机制 |
| #$NPFormation Mechanism of Micro/nanostructure of Reverse-treated Copper Foil and Its Effect on Mechanical Properties |
| 投稿时间：2023-09-08 修订日期：2024-01-09 |
| DOI：10.16490/j.cnki.issn.1001-3660.2024.16.019 |
| 中文关键词: 铜箔 电镀 反向处理 微纳结构 粗糙度 拉伸性能 |
| 英文关键词:copper foil electroplate reverse treatment micro-nano structure roughness tensile properties |
| 基金项目:甘肃省科技计划项目——科技重大专项计划(21ZD4GA029) |
|
|
| Author | Institution |
| GAO Haoyang | School of Materials Science and Engineering Lanzhou 730050, China;State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou 730050, China |
| ZHENG Yuehong | School of Materials Science and Engineering Lanzhou 730050, China;State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou 730050, China |
| NIU Jianan | School of Materials Science and Engineering Lanzhou 730050, China;State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou 730050, China |
| ZHU Min | School of Materials Science and Engineering Lanzhou 730050, China;State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou 730050, China |
| LA Peiqing | School of Materials Science and Engineering Lanzhou 730050, China;State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou 730050, China |
| ZHU Sijia | School of Materials Science and Engineering Lanzhou 730050, China |
|
| 摘要点击次数: |
| 全文下载次数: |
| 中文摘要: |
| 目的 第五代移动通信技术(5G)时代，高频高速信号传输过程中由于“趋肤效应”引起的信号损耗甚至“失真”越来越严重，为了解决这一问题，提出了一种反向处理铜箔的新技术，然而国内当前应用的高性能反向处理铜箔(RTF)主要依赖进口，要想在短时间内缩小国内外铜箔性能和生产效率的差距，最终实现这类高端铜箔的国产化，必须在明确该类铜箔微纳结构形成机理及其对性能影响的前提下，加快制备工艺的开发和优化。方法 采用电镀法在阴极钛辊上沉积了电解生箔，在其光面进行粗化和镀Zn层等后续处理获得反向处理铜箔，同时以国外反向处理铜箔为参照，采用X射线衍射仪、扫描电子显微镜和透射电子显微镜详细分析其微纳组织与结构，采用激光共聚焦显微镜和万能试验机测量其粗糙度和拉伸性能。结果 本工作中的RTF具有与国外商业产品相似的微观结构，由小的等轴晶和较大的柱状晶组成，且包含较多的纳米孪晶，孪晶界占比为30.8%，平均宽度为7.9 nm。S面是均匀的米粒状铜颗粒，而M面是较大的圆锥形铜颗粒。S面上的Zn层均匀致密，厚度约为6.5 nm，只有小部分Zn扩散到基底上形成CuZn3相。但从S面到M面，优选取向从(111)Cu逐渐变为(220)Cu，这与参比RTF略有不同。性能方面，参比RTF的Ra和Rz分别为1.22、1.42 μm，抗拉强度为335.10 MPa，伸长率为15.5%，本工作中的RTF具有较低的粗糙度，Ra和Rz分别为0.68、1.03 μm，其强度也具有明显优势(393.68 MPa)，但延展性低于参比样品。通过对比分析，总结了铜箔在初始外延、过渡生长和电沉积条件控制的生长阶段3个阶段的生长特性，给出了影响每个阶段晶粒生长的主要因素，并且详细讨论了晶粒尺寸和纳米孪晶宽度对铜箔拉伸性能的影响。结论 对RTF微观结构和性能的深入研究，有助于找到高性能铜箔国产化“瓶颈”的根源，为高性能铜箔在5G通信领域的进一步发展和应用奠定基础。 |
| 英文摘要: |
| In the era of the fifth generation mobile communication technology (5G), the signal loss and even "distortion" caused by the skin effect in high-frequency high-speed signal transmission are becoming more and more serious. To overcome this problem, a new technique for treating copper foil in reverse is proposed. However, the high-performance reverse-treated copper foils (RTF) for domestic applications mainly rely on imports. In order to narrow the gap between the performance and production efficiency of domestic and foreign copper foils in a short period of time, and finally realize the localization of such high-end copper foil, the premise must be to accelerate the development and optimization of the preparation process on the basis of clear micro-nano structure formation mechanism and its effect on performance. In the present paper, electrolytic foils were deposited on the cathode titanium roller by electroplating, and subsequent treatments such as roughening and Zn plating were carried out on smooth surfaces to obtain RTFs. Then a foreign RTF was used as a reference sample, an X-ray diffractometer, a scanning electron microscope and a transmission electron microscope were used to analyze their structure in detail. Finally, a laser confocal microscope and a universal testing machine were used to measure their roughness and tensile properties. The results showed that the RTF in this work had a similar microstructure to foreign commercial products, consisting of small equiaxed crystals and larger columnar crystals, and contained a high content of nano twins. The proportion of twin boundary was 30.8% and its average width was 7.9 nm. The S plane had uniform rice shaped copper particles, while the M plane had larger conical copper nodule particles. The amorphous Zn coating on the S plane was homogeneous and dense; the thickness was about 6.5 nm. Only a small part of Zn diffused to the substrate to form CuZn3 phases. But from the S plane to the M plane, the preferred orientation gradually changed from (111)Cu to (220)Cu, which was slightly different from the reference RTF. In terms of performance, the Ra and Rz of reference RTF were 1.22 and 1.42 μm, respectively, tensile strength was 335.10 MPa and elongation was 15.5%. The RTF in this work had lower roughness, the Ra and Rz were 0.68 and 1.03 μm, respectively, and its strength also had obvious advantages (393.68 MPa), but the ductility was lower than that of the reference sample, only 6.54%. Through comparative analysis, the growth characteristics of copper foil in three stages of initial epitaxy, overgrowth and growth stage controlled by electrodeposition conditions were summarized, and the main factors affecting the grain growth of each stage were given. Then the effects of grain size and nanotwin width on tensile properties of copper foil were discussed in detail. In short, the in-depth study of the microstructure and performance of RTF facilitates the identification of the root cause of the "bottleneck" in the localization of high-performance copper foil, which can lay the foundation for the further development and application of high-performance copper foil in the 5G communication field. |
| 查看全文 查看/发表评论 下载PDF阅读器 |
| 关闭 |
|
|
|
渝公网安备 50010702501715号