杨堃,姚孟智,杜佳玮,韩冬宁,孙小岚,李晓东.基于无颗粒银导电墨水在不锈钢表面镀银工艺研究[J].表面技术,2024,53(16):208-218.
YANG Kun,YAO Mengzhi,DU Jiawei,HAN Dongning,SUN Xiaolan,LI Xiaodong.Silver Plating on Stainless Steel Surface Based on Particle-free Silver Conductive Ink[J].Surface Technology,2024,53(16):208-218 |
| 基于无颗粒银导电墨水在不锈钢表面镀银工艺研究 |
| Silver Plating on Stainless Steel Surface Based on Particle-free Silver Conductive Ink |
| 投稿时间：2023-08-25 修订日期：2024-03-12 |
| DOI：10.16490/j.cnki.issn.1001-3660.2024.16.018 |
| 中文关键词: 不锈钢 无颗粒银墨水 镀银 导电性 结合力 |
| 英文关键词:stainless steel particle-free silver ink silver plating electrical conductivity adhesion |
| 基金项目:国家重点研发计划项目(2017YFB0305700) |
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| Author | Institution |
| YANG Kun | Shenyang Aircraft Corporation, Shenyang 110034, China |
| YAO Mengzhi | School of Materials Science and Engineering, Northeastern University, Shenyang 110004, China |
| DU Jiawei | School of Materials Science and Engineering, Northeastern University, Shenyang 110004, China |
| HAN Dongning | Shenyang Aircraft Corporation, Shenyang 110034, China |
| SUN Xiaolan | Shenyang Aircraft Corporation, Shenyang 110034, China |
| LI Xiaodong | School of Materials Science and Engineering, Northeastern University, Shenyang 110004, China |
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| 中文摘要: |
| 目的 采用无颗粒银导电墨水对不锈钢表面进行镀银研究，以绿色环保工艺替代传统电镀银技术。方法 主要研究适用于不锈钢基材的前驱体银源、络合剂种类、不锈钢前处理方法、烧结固化温度对不锈钢表面银层微观结构及性能的影响，获得不锈钢基材上微观结构致密、性能良好的银层。采用X射线衍射仪、扫描电子显微镜、激光共聚焦显微镜、数字兆欧表对在不锈钢表面银膜层进行表征。结果 不锈钢通过1,2丙二胺溶液处理后，采用银源草酸银为前驱体，此时银层微观结构最致密，具有最佳的附着力等级(5B)和最低的粗糙度(1.237 μm)，与1,2-丙二胺络合，乙醇为溶剂时，制备出的银层有机物挥发完全，微观结构致密，并且具有最低的接触电阻0.7 Ω和粗糙度0.80 μm。烧结固化温度为200 ℃时银层导电性最好。结论 采用无颗粒银导电墨水对不锈钢表面进行镀银的新型工艺银层性能良好，可以简化传统电镀技术复杂的操作流程，减少传统电镀工艺所使用氰化物对人体造成的危害，并弥补应用受限的缺点。 |
| 英文摘要: |
| Stainless steel has excellent corrosion resistance and is often used in mechanical equipment. In order to improve the electrical conductivity of stainless steel, it is usually metallized on the surface. However, the traditional silver plating technology is electroplating technology, which requires the use of cyanide and other highly toxic reagents, seriously polluting the environment and human health. The particle-free silver conductive ink can be coated on various substrates to realize the application of miniaturized and highly conductive devices. Only silver precursor, solvent, and complexing agent configuration are suitable for simple operation and green environmental protection of metal layer with good bonding properties and electrical conductivity. The work aims to adopt particle-free silver conductive ink to study the silver plating on stainless steel surface, and replace the traditional silver plating technology with this green technology. The refined particle-free silver conductive ink was coated on the stainless steel substrate with the passivated film surface removed. After sintering and curing in the oven, the metal silver ions in the solution were reduced to silver particles. With the capillary force caused by liquid volatilization, the silver particles were further pulled into each other and closely connected, and the crystal nuclei grew, and uniform and dense silver films were generated in situ on the stainless steel. The surface metallization was finished to improve its electrical conductivity. Firstly, a particle-free conductive ink suitable for the surface metallization of stainless steel was prepared, and different precursor silver sources were configured by ion exchange method. Ethanol was used as solvent for complexing reaction with different complexing agents, and 0.22 μm filter was used to form a particle-free conductive ink. Secondly, the stainless steel surface was pre-treated by different methods to remove the passivation film on the stainless steel surface. Finally, the effect of the post-treatment temperature on the microstructure and properties of the silver layer on the stainless steel surface was investigated by setting different sintering and curing temperatures. The silver film on the surface of stainless steel was characterized by X-ray diffractometer, scanning electron microscope, laser confocal microscope and digital megohm meter. The results showed that after the stainless steel was treated with 1, 2-propylenediamine solution, the silver oxalate was used as the precursor, and the silver layer had the densest microstructure, the best adhesion grade (5B) and the lowest roughness (1.237 μm). When the stainless steel was complexed with 1, 2-propylenediamine, the ethanol was used as the solvent. The prepared silver layer organic compounds volatilized completely, with dense microstructure, and had the lowest contact resistance of 0.7 Ω and roughness of 0.80 μm. The silver layer had the best conductivity when the sintering and curing temperature was 200 ℃. The conclusion is that the silver layer prepared by the new process with particle-free silver conductive ink for silver plating on the surface of stainless steel has good performance, can simplify the complicated operation flow of the traditional electroplating technology, reduce the harm of the cyanide used in the traditional electroplating technology to the human body, and overcome the shortcomings of limited application. |
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