姜帅,付秀丽,王振达,潘永智,蒋振峰.超声椭圆振动切削技术及装置应用研究现状及进展[J].表面技术,2023,52(9):10-22.
JIANG Shuai,FU Xiu-li,WANG Zhen-da,PAN Yong-zhi,JIANG Zhen-feng.Research Status and Progress of Ultrasonic Elliptical Vibration Cutting Technology and Device Application[J].Surface Technology,2023,52(9):10-22
超声椭圆振动切削技术及装置应用研究现状及进展
Research Status and Progress of Ultrasonic Elliptical Vibration Cutting Technology and Device Application
投稿时间:2022-06-09  修订日期:2022-09-28
DOI:10.16490/j.cnki.issn.1001-3660.2023.09.002
中文关键词:  超声椭圆振动切削  超声椭圆振动切削装置  加工性能  复合超声振动  双激励  单激励
英文关键词:ultrasonic elliptical vibration cutting  ultrasonic elliptical vibration cutting device  processing performance  compound ultrasonic vibration  double excitation  single excitation
基金项目:国家自然科学基金面上项目(52175408);山东省自然科学基金重点项目(ZR2020KE022);山东省自然科学基金面上项目(ZR202102280460)
作者单位
姜帅 济南大学 机械工程学院,济南 250022 
付秀丽 济南大学 机械工程学院,济南 250022 
王振达 济南大学 机械工程学院,济南 250022 
潘永智 济南大学 机械工程学院,济南 250022 
蒋振峰 山东淄博大亚金属科技股份有限公司,山东 淄博 255318 
AuthorInstitution
JIANG Shuai School of Mechanical Engineering, University of Jinan, Jinan 250022, China 
FU Xiu-li School of Mechanical Engineering, University of Jinan, Jinan 250022, China 
WANG Zhen-da School of Mechanical Engineering, University of Jinan, Jinan 250022, China 
PAN Yong-zhi School of Mechanical Engineering, University of Jinan, Jinan 250022, China 
JIANG Zhen-feng Shandong Zibo Daya Metal Technology Co., Ltd., Shandong Zibo 255318, China 
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中文摘要:
      首先,阐述了超声椭圆振动切削技术、原理及其装置特点,着重论述了装置各构成部分的特点及其主要应用类型与材料。其次,分析了国内外学者在双激励、单激励方式下实现纵弯、纵扭、双弯曲和弯扭等复合超声振动装置结构设计及其优化方面的研究成果与进展,并且比较了超声椭圆振动切削与传统加工在加工性能、工件表面质量和加工精度等方面的加工优势与适用范围,以及不同超声振动装置在各切削加工中所能获得的加工效果。最后,对超声椭圆振动切削装置的发展趋势进行了总结和展望,指出该装置发展将朝着结合能场的方向发展。
英文摘要:
      Firstly, the technology, principle and device characteristics of ultrasonic elliptical vibration cutting were introduced. The formation mechanism of elliptical orbit, the characteristics of each part of the device and its main application types and materials were discussed emphatically. The structure of ultrasonic elliptical vibration cutting device mainly included four parts:ultrasonic generator, ultrasonic transducer, horn and cutter head. In ultrasonic elliptical vibration cutting, the high-frequency elliptical ultrasonic structures mainly included piezoelectric transducer, composite variable cross-section horn and polycrystalline diamond tool. Secondly, two methods of ultrasonic elliptical vibration cutting were introduced. One was to excite two groups of piezoelectric ceramic stacks with electrical signals to generate two one-dimensional vibrations with phase difference. The other was to excite a group of piezoelectric ceramic laminates with electrical signals to generate one-dimensional vibration, which was induced into composite vibration under the action of special mode conversion horn. The research results of domestic and foreign scholars on the structural design of composite ultrasonic vibration devices such as longitudinal bending composite materials were analyzed. Under these two excitation modes, there were longitudinal torsional composite materials, composite double bending and bending torsional composite materials. It mainly included the design of ultrasonic transducer and horn structure, and also mentioned the research and development of the device in frequency degeneracy and other optimization. Based on four kinds of composite ultrasonic elliptical vibration devices, the machining advantages and application scope of ultrasonic elliptical vibration cutting and traditional machining in machining performance, workpiece surface quality and machining accuracy were compared, as well as the machining effects obtained by different ultrasonic vibration devices in various machining processes. It was pointed out that ultrasonic elliptical vibration machining had the advantages of reducing cutting force, cutting temperature, reducing surface roughness, delaying tool wear, promoting stable chip outflow and improving machining accuracy. Finally, the development trend of the ultrasonic elliptical vibration cutting device was summarized and prospected, and the shortcomings of the previous device research were summarized, such as the small stiffness of the transducer, the low mode conversion efficiency, and the inability to achieve the same frequency resonance, which could be used as a reference for subsequent research. It was pointed out that the ultrasonic elliptical vibration device had gradually expanded from the field of mechanical manufacturing to the field of biopharmaceutical and micro nano manufacturing, and might develop towards the field of binding energy in the future.
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