刘赛赛,贾卫平,吴蒙华,钱宁开,佐姗姗.电沉积增材制造微镍柱的工艺研究[J].表面技术,2021,50(5):95-101.
LIU Sai-sai,JIA Wei-ping,WU Meng-hua,QIAN Ning-kai,ZUO Shan-shan.Research on Micro Nickel Column by Electrochemical Deposition Additive Manufacturing Technology[J].Surface Technology,2021,50(5):95-101 |
| 电沉积增材制造微镍柱的工艺研究 |
| Research on Micro Nickel Column by Electrochemical Deposition Additive Manufacturing Technology |
| 投稿时间：2020-09-14 修订日期：2021-02-22 |
| DOI：10.16490/j.cnki.issn.1001-3660.2021.05.009 |
| 中文关键词: 增材制造 电沉积 微镍柱 极间距 极间电压 |
| 英文关键词:additive manufacturing electrochemical deposition micro nickel column interelectrode gap interelectrode voltage |
| 基金项目:国家自然科学基金(51875071);辽宁省自然科学基金(20180550227) |
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| Author | Institution |
| LIU Sai-sai | Dalian University, Dalian 116622, China |
| JIA Wei-ping | Dalian University, Dalian 116622, China |
| WU Meng-hua | Dalian University, Dalian 116622, China |
| QIAN Ning-kai | Dalian University, Dalian 116622, China |
| ZUO Shan-shan | Dalian University, Dalian 116622, China |
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| 中文摘要: |
| 目的 探究电沉积工艺参数对无掩模定域性增材制造微镍柱的微观形貌、直径和沉积速率的影响。方法 采用尖锥形铂丝作为阳极、铜板作为阴极，电镀液从阳极和导流腔之间的微缝隙以射流方式流到阴极表面，电化学沉积增材制造微镍柱。采用体视显微镜和扫描电子显微镜对镍柱微观结构进行检测。通过单因素试验研究极间电压和初始极间距对微镍柱微观形貌、沉积速率和直径的影响规律。结果 初始极间距为10 μm、电压为3.8~ 4.4 V时，可以制备出直径均匀、圆柱度较高的微镍柱;电压增至4.7 V时，微镍柱形状不规则，常伴有分叉现象或呈瘤状沉积。极间电压从3.8 V增加到4.7 V时，微镍柱体积沉积速率由539 μm3/s增长至4159 μm3/s，直径由55 μm增长至102 μm。此外，当极间电压为4.1 V、初始极间距为20~40 μm时，随着初始极间距的增大，微镍柱顶端从圆柱形逐渐转向锥形沉积。结论 极间电压对微镍柱微观形貌、沉积速率和直径的影响明显，初始极间距主要影响微镍柱顶端的沉积生长形状。 |
| 英文摘要: |
| The effects of electrodeposition parameters were investigated on the microscopic morphology, diameter and deposition rate of micro nickel column prepared by maskless localized electrodeposition additive manufacturing technology. Micro nickel columns were fabricated on electrochemical deposition experimental platform that a pointed cone-shaped platinum wire is used as the anode and a copper plate is used as the cathode, and the electroplating solution flows to the surface of the cathode in the way of jet flow from the micro gap between the anode and the diversion cavity. Stereo microscope and scanning electron microscope (SEM) were used to detect the microstructure of the nickel column. The influence of interelectrode voltage and initial interelectrode gap on the microscopic morphology, deposition rate and diameter of micro nickel column were studied by single factor experiments. Theresults showed that micro-nickel columns with uniform diameter and high cylindricity can be prepared when the initial electrode spacing was 10μm and the voltage was 3.8~4.4 V, while the micro nickel columns were irregular in shape accompanied by bifurcation or tumor-like deposits when the voltage was increased to 4.7 V. When the electrode voltage increased from 3.8 V to 4.7 V, the deposition rate of micro nickel columns increased from 539 μm3/s to 4159 μm3/s, and the diameter increased from 55 μm to 102 μm. In addition, when the interelectrode voltage was 4.1 V and the initial electrode spacing was 20~40 μm, with the increase of the initial electrode spacing, the tip of the micro-nickel columns were changed from cylindrical to conical deposition. The interelectrode voltage has a significant effect on the microscopic morphology, deposition rate and diameter of the micro-nickel columns, while the initial interelectrode gap mainly affects the deposition shape of the micro-nickel columns. |
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