李奇松,钱慧璇,付旭,孙海静,孙杰.ChCl-EG中铜锡合金的电沉积行为及耐蚀性研究[J].表面技术,2021,50(4):313-318.
LI Qi-song,QIAN Hui-xuan,FU Xu,SUN Hai-jing,SUN Jie.Electrodeposition Behaviors and Corrosion Resistance of Copper-Tin Alloy Coating in ChCl-EG Deep Eutectic Solvents[J].Surface Technology,2021,50(4):313-318 |
| ChCl-EG中铜锡合金的电沉积行为及耐蚀性研究 |
| Electrodeposition Behaviors and Corrosion Resistance of Copper-Tin Alloy Coating in ChCl-EG Deep Eutectic Solvents |
| 投稿时间：2020-04-01 修订日期：2021-03-03 |
| DOI：10.16490/j.cnki.issn.1001-3660.2021.04.032 |
| 中文关键词: 低共熔溶剂 铜锡合金 电沉积 相组成 耐蚀性 |
| 英文关键词:deep eutectic solvents copper-tin alloy electrodeposition phase composition corrosion resistance |
| 基金项目:辽宁省-沈阳材料科学国家研究中心联合研发基金资助(2019JH3/30100021) |
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| Author | Institution |
| LI Qi-song | School of Environmental and Chemical Engineering, Shenyang Ligong University, Shenyang 110159, China |
| QIAN Hui-xuan | School of Environmental and Chemical Engineering, Shenyang Ligong University, Shenyang 110159, China |
| FU Xu | School of Environmental and Chemical Engineering, Shenyang Ligong University, Shenyang 110159, China |
| SUN Hai-jing | School of Environmental and Chemical Engineering, Shenyang Ligong University, Shenyang 110159, China |
| SUN Jie | School of Environmental and Chemical Engineering, Shenyang Ligong University, Shenyang 110159, China |
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| 中文摘要: |
| 目的 研究氯化胆碱-乙二醇低共熔溶剂中进行不同浓度比例下的铜锡合金电沉积的电化学行为及镀层微观形貌、相组成、耐蚀性能。方法 使用阴极极化曲线对铜锡合金还原行为进行研究，使用扫描电子显微镜以及X射线衍射仪等研究电极电位对银镀层微观形貌的影响及银镀层的相组成，同时采用EDS分析铜锡合金镀层的元素组成。使用极化曲线对铜锡合金镀层的耐蚀性能进行研究分析。结果 在−0.95 V电位时，铜锡发生共沉积。在该电位下，铜以合金形式存在，而锡以合金和单质的形式存在。不同金属离子含量的电沉积体系得到不同成分的镀层。镀液中的铜锡含量明确影响镀层中的铜锡含量，当镀液中铜或锡含量偏高时，镀层质量更好。在ChCl-EG低共熔溶剂中，当CuCl2.2H2O与SnCl2.2H2O的含量(mol/L)分别为0.192:0.048、0.192:0.192、0.048:0.192时，得到的镀层的相组成分别为β-Cu5.6Sn、η-Cu6Sn5+β-Cu5.6Sn、η-Cu6Sn5。结论 随着镀液中锡含量不断增多，其相组成由β-Cu5.6Sn相向η-Cu6Sn5相发生转变，并且在沉积层中出现了锡相。镀液中铜或锡含量偏高时，镀层质量反而更好。耐蚀性测试显示镀液中Sn含量为84.2%时，镀层腐蚀速率最小，镀层的耐蚀性最优。 |
| 英文摘要: |
| The work aims to study the electrochemical behavior, microstructure, phase composition and corrosion resistance of electrodeposited Cu-Sn alloy with different concentration ratio in low eutectic solvent. The cathodic polarization curve was used to study the reduction behavior of copper-tin alloy, the influence of electrode potential on the microstructure of silver coating and the phase composition of silver coating were studied by means of scanning electron microscope (SEM) and X-ray diffraction (XRD), and EDS was used to analyze the element composition of copper-tin alloy coating. The corrosion resistance of Cu-Sn alloy coating was studied by polarization curve. Cu-Sn co-deposition occurs at −0.95 V potential. At this potential, copper exists in alloy form, while tin exists in alloy and elemental form. Electrodeposition system with different metal ion content can obtain different coatings. The content of copper and tin in the plating bath definitely affects the content of copper and tin in the plating bath. In the ChCl-EG deep eutectic solvents, when the content (mol/L) of CuCl2.2H2O and SnCl2.2H2O was 0.192:0.048, 0.192:0.192 and 0.048:0.192, respectively, the phase composition of the obtained coating was β-Cu5.6Sn phase, η-Cu6Sn5 phase and β-Cu5.6Sn phase, and η-Cu6Sn5 phase. As the tin content in the plating solution increased, the phase composition changed from β-Cu5.6Sn phase to η-Cu6Sn5 phase, and the tin phase appeared in the coating. When the copper or tin content in the bath is on the high side, the coating quality is better. The corrosion resistance test showed that the corrosion rate was the lowest when the content of Sn ions in the plating solution was 84.2%, and the corrosion resistance of the coating was optimal under this condition. |
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