王虎,朱延玲.碳纳米管预处理及表面化学镀铜[J].表面技术,2019,48(11):211-218.
WANG Hu,ZHU Yan-ling.Pretreatment and Copper Plating of Carbon Nanotubes by Electroless Deposition[J].Surface Technology,2019,48(11):211-218 |
| 碳纳米管预处理及表面化学镀铜 |
| Pretreatment and Copper Plating of Carbon Nanotubes by Electroless Deposition |
| 投稿时间：2019-01-16 修订日期：2019-11-20 |
| DOI：10.16490/j.cnki.issn.1001-3660.2019.11.022 |
| 中文关键词: 碳纳米管 预处理 化学沉积 铜镀层 |
| 英文关键词:carbon nanotubes pretreatment electroless deposition copper plating |
| 基金项目:国家自然科学基金（51374039）；中铝材料院自主立项基金（YB1829） |
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| 中文摘要: |
| 目的 在CNTs表面镀上一层均匀分布的铜镀层，以此优化CNTs在金属基体中的润湿性，提高CNTs与金属基体之间的界面结合力，实现CNTs在金属基体中的均匀分散，为制备高性能金属基复合材料提供途径。方法 首先对CNTs进行预处理，包括纯化、氧化、敏化、活化，再进行表面化学镀铜，从而在CNTs表面获得均匀分布的铜镀层。采用扫描电镜（SEM），透射电镜（TEM）、拉曼光谱（Raman）等测试方法对不同处理后的CNTs进行微观组织表征。结果 CNTs经过预处理后，实现了CNTs表面镀铜。同时，在化学镀铜过程中，铜镀层在CNTs表面的生长并不是一个持续稳定的过程，首先在活化程度较高的位置形核长大，再横向生长，最终覆盖整个CNTs表面。实验得到了CNTs镀铜的最佳参数：CuSO4•5H2O的质量浓度为18 g/L，镀铜时间为15 min。在此条件下，铜镀层的分布比较均匀，单根CNTs上不同部位的镀层厚度基本相同，铜镀层的平均厚度为25 nm。结论 CNTs经过预处理后，表面形成了含氧官能团，镀铜过程去除了CNTs表面的大部分官能团，并在其表面获得均匀分布的纳米级厚度的铜镀层，改善了CNTs在金属基体中的润湿性，为CNTs应用到金属基复合材料提供重要途径。 |
| 英文摘要: |
| The work aims to improve the wettability of CNTs and the interfacial bonding force between CNTs and metal matrix by plating a uniformly distributed copper coating on the surface of CNTs through electroless deposition, so as to realize uniform dispersion of CNTs in the metal matrix, and provide an approach to prepare excellent metal matrix composites. Firstly, CNTs were pretreated, including purification, oxidation, sensitization and activation. Then, electroless copper plating was carried out on the surface so as to obtain uniformly distributed copper plating on the surface of CNTs. The microstructures of CNTs in different states were characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM) and Raman spectroscopy (Raman). The copper plating on the CNTs could be realized after pretreatment. Meanwhile, the growth of the copper plating on surface of CNTs was not a continuous and stable process. First, it nucleated and grew at a higher activation level, then grew horizontally, and eventually covered the whole surface of CNTs. The optimum preparation conditions of electroless deposition were obtained through the experiment. The concentration of CuSO4•5H2O was 18 g/L and the reaction time was 15 min. Thus, a layer of uniform copper plating was successfully grown on the CNTs, and the plating thickness of different parts on single CNTs was basically the same, so the average thickness of copper plating was 25 nm. After pretreatment of CNTs, oxygen-containing functional groups are formed on the surface. The copper plating process removes most of the functional groups on the surface of CNTs, and a uniform nano-sized copper plating is obtained on the surface of CNTs, which improves the wettability of CNTs in metal matrix and provides an important way for CNTs to be applied to metal matrix composites. |
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