殷赳,陈根余,熊彪,朱智超,王彦懿,金梦奇,胡搒.飞秒激光加工单晶金刚石制备正前角磨削工具[J].表面技术,2019,48(2):33-39.
YIN Jiu,CHEN Gen-yu,XIONG Biao,ZHU Zhi-chao,WANG Yan-yi,JIN Meng-qi,HU Bang.Grinding Tools with Positive Rake Angle Prepared by Femtosecond Pulsed Laser Machining of Single Crystal Diamond[J].Surface Technology,2019,48(2):33-39 |
| 飞秒激光加工单晶金刚石制备正前角磨削工具 |
| Grinding Tools with Positive Rake Angle Prepared by Femtosecond Pulsed Laser Machining of Single Crystal Diamond |
| 投稿时间：2018-11-13 修订日期：2019-02-20 |
| DOI：10.16490/j.cnki.issn.1001-3660.2019.02.005 |
| 中文关键词: 飞秒激光 单晶金刚石 微磨粒阵列 磨削工具 正前角 |
| 英文关键词:femtosecond laser single crystal diamond microabrasive array grinding tools positive rake angle |
| 基金项目:国家自然科学基金资助项目（51675172） |
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| Author | Institution |
| YIN Jiu | 1.Laser Research Institute, Hunan University, Changsha 410082, China; 2.School of Mechanical and Electrical Engineering, Hunan City University, Yiyang 413000, China |
| CHEN Gen-yu | 1.Laser Research Institute, Hunan University, Changsha 410082, China; 3.State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, Changsha 410082, China |
| XIONG Biao | 1.Laser Research Institute, Hunan University, Changsha 410082, China |
| ZHU Zhi-chao | 1.Laser Research Institute, Hunan University, Changsha 410082, China |
| WANG Yan-yi | 1.Laser Research Institute, Hunan University, Changsha 410082, China |
| JIN Meng-qi | 1.Laser Research Institute, Hunan University, Changsha 410082, China |
| HU Bang | 1.Laser Research Institute, Hunan University, Changsha 410082, China |
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| 中文摘要: |
| 目的 制造一种磨粒有序排布、具有正前角的无结合剂端面金刚石磨削工具。方法 采用波长为1030 nm、脉宽为250 fs的钛蓝宝石飞秒激光对单晶金刚石（SCD）进行烧蚀加工，首先研究加工工艺参数（特别是烧蚀轨迹间距）对金刚石加工效率及表面质量的影响。采用预先设计的激光扫描路径，基于优化后的工艺参数在SCD表面加工出微磨粒阵列结构，各磨粒呈方锥台形结构，其顶部倾斜角约为100°。在此基础上，对微磨粒阵列进行烧蚀加工，将所有微磨粒顶部的倾斜角减小至小于90°。结果 当激光烧蚀轨迹间距为10.0 μm时，烧蚀加工表面RMS粗糙度最小。确定了一种微磨粒边缘倾斜角小于90°且磨粒有序排布的新型无结合剂金刚石端面磨削工具的激光制备方法和工艺，采用该工艺加工的磨削工具表面质量好，轮廓精度高，磨粒平均正前角约为9.80°。结论 采用飞秒激光可以高质量、高效率地制备出磨粒有序排布的新型正前角无结合剂金刚石端面磨削工具，该工具有望在硬脆材料磨削中减小磨削力，提高材料表面完整性。 |
| 英文摘要: |
| The work aims to fabricate a binder-less diamond face grinding tool with abrasive particles arranged in order and positive rake angle. A Ti: Sapphire femtosecond laser with a wavelength of 1030 nm and a pulse width of 250 fs was used to ablate and process the SCD. The effects of processing parameters, especially the ablation track pitch on the processing efficiency and surface quality of the diamond, were investigated in advance. Based on the optimal processing parameters, an array of square frustum microabrasive with grain inclination angle of approximately 100° was fabricated on the surface of SCD according to the predesigned laser scanning path. The microabrasive array was subsequently ablated to reduce the inclination angle at the edge of the micro grains below 90°. When the optimal ablation track pitch was determined to be 10.0 μm, the minimum RMS roughness could be achieved on the ablation surface. The laser fabrication process and method of a novel abrasive regularly arranged binder-less diamond face grinding tool with acute inclination angle less than 90° at the edge of the micro grains were elaborated. The fabricated tool showed good surface quality and high profile accuracy and had an average positive rake angle of 9.80°. Femtosecond laser can prepare a new binder-less diamond face grinding tool with abrasive particles arranged in order and positive rake angle efficiently and this kind of tool is expected to reduce the grinding force and enhance the surface integrity of the machined hard and brittle materials. |
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