尹韶辉,杨宏亮,陈逢军,耿军晓,张俊杰.硅晶圆分层划片工艺试验研究[J].表面技术,2018,47(7):1-7.
YIN Shao-hui,YANG Hong-liang,CHEN Feng-jun,GENG Jun-xiao,ZHANG Jun-jie.Experimental Research on Step Cut Process of Silicon Wafer[J].Surface Technology,2018,47(7):1-7 |
| 硅晶圆分层划片工艺试验研究 |
| Experimental Research on Step Cut Process of Silicon Wafer |
| 投稿时间：2018-02-11 修订日期：2018-07-20 |
| DOI：10.16490/j.cnki.issn.1001-3660.2018.07.001 |
| 中文关键词: 硅晶圆 单次划片 分层划片 崩边 相对缝宽 切削力 划切质量 |
| 英文关键词:silicon wafer single cut step cut chipping relative kerf width cutting force dicing quality |
| 基金项目:国家自然科学基金项目（51675171）；湖南省重点研发计划（2017WK2031） |
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| Author | Institution |
| YIN Shao-hui | National Engineering Research Center for High Efficiency Grinding, Hunan University, Changsha 410082, China |
| YANG Hong-liang | National Engineering Research Center for High Efficiency Grinding, Hunan University, Changsha 410082, China |
| CHEN Feng-jun | National Engineering Research Center for High Efficiency Grinding, Hunan University, Changsha 410082, China |
| GENG Jun-xiao | National Engineering Research Center for High Efficiency Grinding, Hunan University, Changsha 410082, China |
| ZHANG Jun-jie | National Engineering Research Center for High Efficiency Grinding, Hunan University, Changsha 410082, China |
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| 中文摘要: |
| 目的 优化硅晶圆划片工艺参数，提高划片质量。方法 提出一种硅晶圆分层划片工艺方法，利用自主研发的精密全自动划片机，通过全因素试验，研究了主轴转速、进给速度和切削深度等工艺参数对分层划片与传统单次划片的工艺性能的影响，检测了崩边宽度、相对缝宽、切缝表面粗糙度，通过检测划片过程中主轴电流大小来间接反映切削力的大小。最后对分层划片工艺进行优化试验，得出最佳工艺参数组合。结果 随着划片深度的增加，主轴电流增大，进给速度对主轴电流的影响较小，分层划片可以有效减少划片过程产生的切削力，提高划切效果。分层划片试验发现，随主轴转速的增加，相对缝宽增大；随进给速度增大，相对缝宽先减小后增大。进给速度为15 mm/s，转速为10 000 r/min时，相对缝宽最小，为1.048。随着主轴转速的增加，崩边宽度减小；随着进给速度的增大，崩边宽度增大。进给速度为1 mm/s，转速为25 000 r/min时，崩边宽度最小，为5.31 μm。结论 与传统单次划片方式相比，分层划片工艺能够得到更好的划片效果，可一定程度上降低崩边宽度，减小相对缝宽值，减少微裂纹，提高划切质量。 |
| 英文摘要: |
| The work aims to optimize process parameters of silicon wafer dicing and improve dicing quality. A new method of step cut process was proposed. With a self-developed precision full-automatic dicing machine, influences of such process parameters as spindle speed, feed speed and cutting depth on processing properties of step cut and traditional single cut were studied by performing single factor experiment. Chipping width, relative kerf width and kerf surface roughness were tested. Cutting forces were indirectly reflected by measuring the spindle current in the dicing process. Finally, optimization experiment was applied to step cut process, and the optimum combination of process parameters was obtained. With the increase of dicing depth, the spindle current increased. Feed speed had slight influence on spindle current. Step cut could effectively reduce the cutting forces generated during dicing and improve the dicing effects. Step cut test showed that: the relative kerf width increased as spindle speed increased, and first decreased and then increased as the feed rate increased, the minimum relative kerf width was 1.048 at the feed speed of 15 mm/s and spindle speed of 10 000 r/min; the chipping width decreased as spindle speed increased, and increased as feed speed increased, and minimum chipping width was 5.31 μm at the feed speed of 1 mm/s and spindle speed of 25 000 r/min. Compared with the traditional single cut method, step cut can achieve better dicing effects, reduce chipping width, the relative kerf width and micro-cracks to a certain degree, and improve cutting quality. |
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