李炎,刘玉岭,卜小峰,孙铭斌,杨志欣,张男男,张玉峰,程川.无磨料复合清洗剂对铜膜表面腐蚀缺陷的控制[J].表面技术,2014,43(5):61-65.
LI Yan,LIU Yu-ling,BU Xiao-feng,SUN Ming-bin,YANG Zhi-xin,ZHANG Nan-nan,ZHANG Yu-feng,CHENG Chuan.Regulation of the Surface Defects of Copper Films by Abrasive-free Composite Cleaning Agent[J].Surface Technology,2014,43(5):61-65 |
| 无磨料复合清洗剂对铜膜表面腐蚀缺陷的控制 |
| Regulation of the Surface Defects of Copper Films by Abrasive-free Composite Cleaning Agent |
| 投稿时间：2014-05-02 修订日期：2014-06-17 |
| DOI： |
| 中文关键词: 复合清洗剂 大分子螯合剂 表面活性剂 铜膜 腐蚀速率 |
| 英文关键词:composite cleaning agent macromolecular chelating agent surfactant copper films corrosion rate |
| 基金项目:国家中长期科技发展规划 02 科技重大专项( 2009ZX02308) ; 河北省自 然科学基金( E2013202247, F2012202094) ; 河北省教育厅基金( 2011128) |
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| Author | Institution |
| LI Yan | Institute of Microelectronic Technique and Materials, Hebei University of Technology, Tianjin 300130, China |
| LIU Yu-ling | Institute of Microelectronic Technique and Materials, Hebei University of Technology, Tianjin 300130, China |
| BU Xiao-feng | Musi Limited Company of Bedroom Supplies, Dongguan 523000, China |
| SUN Ming-bin | Institute of Microelectronic Technique and Materials, Hebei University of Technology, Tianjin 300130, China |
| YANG Zhi-xin | Institute of Microelectronic Technique and Materials, Hebei University of Technology, Tianjin 300130, China |
| ZHANG Nan-nan | Institute of Microelectronic Technique and Materials, Hebei University of Technology, Tianjin 300130, China |
| ZHANG Yu-feng | Institute of Microelectronic Technique and Materials, Hebei University of Technology, Tianjin 300130, China |
| CHENG Chuan | Institute of Microelectronic Technique and Materials, Hebei University of Technology, Tianjin 300130, China |
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| 中文摘要: |
| 目 的 研究一种复合清洗剂 对铜膜表面腐 蚀缺陷的 控制 效果。 方法 通过单因 素实验优化无磨料复合清洗剂 组成和相应的清洗工艺, 并通过研究优化的 清洗条件对不 同 类型铜晶 圆 表面划 伤、残留颗粒的清洗效果, 验证该清洗剂 的清洗性能。 结果 优化的 清洗剂 组分和清洗工艺 为: 金属离 子螯合剂体积分数 0. 025% , 表面活性剂 体积分数 0. 1% ; 清洗剂 温度 30 ℃ , 清洗剂 流量 3 L/min。 优化的 复合清洗剂 能大幅度降低铜膜表面划 伤和表面粗糙度, 对铜膜表面残留的颗粒有较强的去除作用 。 结论 优化的复合清洗剂 能够对不同 类型铜晶圆 表面缺陷进行大幅度的修正, 研究成果对提高大规模生产中 晶 圆 的成品率有一定的指导作用 。 |
| 英文摘要: |
| Objective To study the controlling effect of a composite cleaning agent on the surface corrosion defects of copper film. Methods Through the single factor experiment, the composition ratio and corresponding cleaning process of the abrasive free composite cleaning agent were optimized. According to the cleaning effect of the scratches and the residual particles on the copper film surface, the cleaning effect of the cleaning agent mentioned above was verified. Results It was confirmed that the copper film achieved the lowest corrosion rate and surface roughness when the volume fraction of metal ion chelating agent was 0. 025% , the surfactant concentration was 0. 1% , the cleaning agent temperature was 30 ℃ , and the cleaning agent flow rate was 3 L/min. The cleaning agent could reduce the values of the scratches and the surface roughness of the copper films, it also showed strong inhibitory effect on the residual particle number of the copper films. Conclusion The optimized composite cleaning agent showed significant modification effects for different types of copper wafer surface defects, which can play a guiding role in improvement of the wafer yield in mass production. |
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