张琳琪,夏琳,彭进,邹文俊.pH 值和表面活性剂对硅溶胶 CMP 抛光液的影响[J].表面技术,2014,43(4):24-26,36.
ZHANG Lin-qi,XIA Lin,PENG Jin,ZOU Wen-jun.Effects of pH Value and Surfactant on Silicon Sol CMP Slurry[J].Surface Technology,2014,43(4):24-26,36
pH 值和表面活性剂对硅溶胶 CMP 抛光液的影响
Effects of pH Value and Surfactant on Silicon Sol CMP Slurry
投稿时间:2014-02-21  修订日期:2014-04-17
DOI:
中文关键词:  硅溶胶  CMP 抛光液  pH 值  表面活性剂
英文关键词:silica sol  CMP slurry  pH value  surfactant
基金项目:国家自然科学基金(11076010A06)
作者单位
张琳琪 河南工业大学 材料学院, 郑州 450001 
夏琳 河南工业大学 材料学院, 郑州 450001 
彭进 河南工业大学 材料学院, 郑州 450001 
邹文俊 河南工业大学 材料学院, 郑州 450001 
AuthorInstitution
ZHANG Lin-qi School of Materials Science and Engineering, Henan University of Technology, Zhengzhou 450001,China 
XIA Lin School of Materials Science and Engineering, Henan University of Technology, Zhengzhou 450001,China 
PENG Jin School of Materials Science and Engineering, Henan University of Technology, Zhengzhou 450001,China 
ZOU Wen-jun School of Materials Science and Engineering, Henan University of Technology, Zhengzhou 450001,China 
摘要点击次数:
全文下载次数:
中文摘要:
      目的 研究 pH 值以及表面活性剂种类对 CMP 抛光液稳定性及抛光性能的影响。 方法 向硅溶胶中加入酸性或碱性 pH 值调节剂,配制不同 pH 值的 CMP 抛光液;通过添加不同类型的表面活性剂,研究表面活性剂对抛光液的稳定机理。 结果 硅溶胶 CMP 抛光液 pH 值为 9 . 5 时,加入非离子表面活性剂,抛光 90 min 后,铝合金表面粗糙度降低了 55 . 4% ,光亮度增加了 131% ,抛光质量较好。 结论 弱碱环境下,抛光液的稳定性和抛光性能优良,非离子表面活性剂有利于 CMP 抛光液的稳定性。
英文摘要:
      Objective On the basis of preparing silicon sol polishing liquid for CMP process, the effects of pH value and surfactants on the reliability and properties of CMP slurry were studied. Methods Different pH values of CMP polishing liquid were configured through adding acidic or alkaline pH adjusting agent into the polishing liquid. The stabilizing mechanism of surfactants on the polishing solution was studied. Results When the pH of CMP solution was 9. 5, and Non-ionic surfactant was added, after 90 min, the surface roughness of polished aluminum alloy was decreased by 55. 4% , and the brightness was increased by 131% . The polishing quality of aluminum alloy surface was good. Conclusion Research showed the excellent stability and polishing performance of the polishing solution in weakly alkaline condition. Non-ionic surfactants were beneficial to the stability of CMP polishing liquid.
查看全文  查看/发表评论  下载PDF阅读器
关闭

关于我们 | 联系我们 | 投诉建议 | 隐私保护 | 用户协议

您是第24187107位访问者    渝ICP备15012534号-3

版权所有:《表面技术》编辑部 2014 surface-techj.com, All Rights Reserved

邮编:400039 电话:023-68792193传真:023-68792396 Email: bmjs@surface-techj.com

渝公网安备 50010702501715号