李远会,万明攀,陈阵,张晓燕,郭忠诚.电镀 Cu-W-Ni 合金的热力学分析[J].表面技术,2013,42(5):8-10.
LI Yuan-hui,WAN Ming-pan,CHEN Zhen,ZHANG Xiao-yan,GUO Zhong-cheng.Thermodynamics Analysis of Electrodeposited Cu-W-Ni Alloys[J].Surface Technology,2013,42(5):8-10
电镀 Cu-W-Ni 合金的热力学分析
Thermodynamics Analysis of Electrodeposited Cu-W-Ni Alloys
投稿时间:2013-05-22  修订日期:2013-06-30
DOI:
中文关键词:  电镀  Cu-W-Ni 合金  E-pH 图  热力学
英文关键词:electrodeposition  Cu-W-Ni alloys  potential-pH plots  thermodynamics
基金项目:国家自然科学基金(50964008) ;贵州省科学技术基金黔科合 J 字[2012]2114 号
作者单位
李远会 贵州大学 材料与冶金学院, 贵阳 550003;昆明理工大学 冶金与能源工程学院, 昆明 650039 
万明攀 贵州大学 材料与冶金学院, 贵阳 550003 
陈阵 昆明理工大学 冶金与能源工程学院, 昆明 650039 
张晓燕 贵州大学 材料与冶金学院, 贵阳 550003 
郭忠诚 昆明理工大学 冶金与能源工程学院, 昆明 650039 
AuthorInstitution
LI Yuan-hui Faculty of Materials and Metallurgy, University of Guizhou, Guiyang 550003 , China; 
WAN Ming-pan Faculty of Materials and Metallurgy, University of Guizhou, Guiyang 550003 , China 
CHEN Zhen Faculty of Metallurgical and Energy Engineering,Kunming University of Science and Technology, Kunming 650039 , China 
ZHANG Xiao-yan Faculty of Materials and Metallurgy, University of Guizhou, Guiyang 550003 , China 
GUO Zhong-cheng Faculty of Metallurgical and Energy Engineering,Kunming University of Science and Technology, Kunming 650039 , China 
摘要点击次数:
全文下载次数:
中文摘要:
      借助 25 ℃ 下的 Cu-H2O,Ni-H2O 和 W-H2O 的 E-pH 图,说明了电镀 Cu,W,Ni 的可能性及范围,并重点分析了电镀 Cu-W-Ni 合金的可能性。 Cu-Ni 能在 Cu-H2O 与 Ni-H2O 系 E-pH 图叠合形成的共沉积区里析出。 因 Cu-H2O 与 W-H2O 系的 E-pH 图叠合时无法形成 Cu-W 的共沉积区,Cu-W 不能在其对应离子的水溶液中析出,但 Ni-W 能在 Ni2+,WO42-水溶液里诱导共沉积。 理论和实验证明,在含 Cu2+,Ni2+,WO42-的水溶液中能电镀制备 Cu-W-Ni 合金。
英文摘要:
      Theoretically expression of Cu, Ni, W and Cu-W-Ni alloys electrodeposition possibility were thermodynamically analyzed by means of the potential-pH plots of Cu-H2O, Ni-H2O and W-H2O at 25 ℃ normal temperature. It is found that Cu-Ni alloys can be deposited together in the thermodynamical stable region of the Cu-H2O, Ni-H2O potential-pH plots. Cu-W alloys aren't deposited without no thermodynamical stable region of the Cu-H2O, W-H2O potential-pH plots, only if Cu-W-Ni induced electrodeposition under the Ni2+circumstances. It is possible that Ni-W alloys are prepared by the electrodeposition in the theory and experiment, which will be new method and theory for Cu-W-Ni serial contact materials' preparation.
查看全文  查看/发表评论  下载PDF阅读器
关闭

关于我们 | 联系我们 | 投诉建议 | 隐私保护 | 用户协议

您是第23608155位访问者    渝ICP备15012534号-3

版权所有:《表面技术》编辑部 2014 surface-techj.com, All Rights Reserved

邮编:400039 电话:023-68792193传真:023-68792396 Email: bmjs@surface-techj.com

渝公网安备 50010702501715号