贾晓凤,杜朝军.以DMDMH和MET为配位剂的无氰镀银工艺研究[J].表面技术,2010,39(4):59-61,72.
JIA Xiao-feng,DU Chao-jun.Study on Cyanide-free Silver Electroplating Process with DMDMH and MET as Coordination Agents[J].Surface Technology,2010,39(4):59-61,72 |
| 以DMDMH和MET为配位剂的无氰镀银工艺研究 |
| Study on Cyanide-free Silver Electroplating Process with DMDMH and MET as Coordination Agents |
| 投稿时间：2010-04-19 修订日期：2010-08-10 |
| DOI： |
| 中文关键词: DMDMH 蛋氨酸 无氰镀银 配位剂 |
| 英文关键词:DMDMH Met cyanide-free silver electroplating coordination agent |
| 基金项目:河南省教育厅2010年度自然科学研究计划项目(2010C150003) |
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| 中文摘要: |
| 研究了以Met和DMDMH为配位剂的无氰镀银工艺,通过探讨镀液组成及工艺条件对镀层外观质量的影响,确定了最佳电镀工艺。测试了镀液的阴极电流效率、分散能力、覆盖能力,以及银镀层的微观形貌和结合强度等。测试结果表明,该无氰镀银工艺基本达到了氰化物镀银工艺的相关指标,有望成为氰化物镀银的替代工艺。 |
| 英文摘要: |
| A cyanide-free silver electroplating process with Met and DMDMHas coordination agents was studied. The influences of bath composition and operation conditions of the process on the appearance of silver coatings were investigated, and on this basis the optimal electroplating process was defined.It has been found by examinations of cathode current efficiency, throwing power, covering power of the bath and adhesion of the silver films that this process is the same as and even better in some aspects than cyanide process, and worth popularization in industrial applications. |
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