李佳,李德良,莫凌.硝酸型酸性蚀刻液蚀刻工艺的研究[J].表面技术,2010,39(3):87-89.
LI Jia,LI De-liang,MO Ling.Study on Nitrate Acidic Etcher[J].Surface Technology,2010,39(3):87-89 |
| 硝酸型酸性蚀刻液蚀刻工艺的研究 |
| Study on Nitrate Acidic Etcher |
| 投稿时间：2010-03-31 修订日期：2010-06-10 |
| DOI： |
| 中文关键词: 硝酸 硝酸铜 蚀刻液 |
| 英文关键词:nitric acid cupric nitrate etcher |
| 基金项目:湖南省环境科学学科建设项目资助(2006180) |
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| 中文摘要: |
| 研究了以硝酸为主成分的酸性蚀刻液。采用静态蚀刻的实验方法,通过测定蚀刻液对印制电路板铜箔的蚀刻速率和侧蚀量,考察了几个独立因素的影响。结合正交实验得出硝酸型酸性蚀刻液的最佳组分及工艺条件为:Cu2+质量浓度为(140± 10)g/ L,硝酸浓度为(2.5± 0.5)mol/ L,温度为(50± 5)℃。在该条件下,静态蚀刻速率可达到10μm/min,且侧蚀量小。此外,还考察了抑烟剂对蚀刻速率的影响。 |
| 英文摘要: |
| Acid etcher which nitric acid is the main component has been studied. Static etching method was used to investigate the influencing of several independent factors by measuring the etching rate of PCB in etching solution and undercutting level. The orthogonal test result shows that the best components and process conditions of nitrate acidic etcher are the concentration of copper ion(140± 10)g/ L, the concentration of nitric acid(2.5± 0.5)mol/ L, the temperature(50± 5)℃ connecting with orthogonal experiment. In this condition, the etching rate reaches 10μm/min for static process and undercutting level is low. Moreover, the effects of smoke suppressant on etching rates have been discussed. |
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