李薇薇.去除存储器硬盘基片CMP后表面污染物的新方法[J].表面技术,2010,39(3):82-84. LI Wei-wei.New Method about Contaminants Removal for Storage Hard Disk after CMP[J].Surface Technology,2010,39(3):82-84 |
去除存储器硬盘基片CMP后表面污染物的新方法 |
New Method about Contaminants Removal for Storage Hard Disk after CMP |
投稿时间:2009-12-24 修订日期:2010-06-10 |
DOI: |
中文关键词: 硬盘 聚醚类活性剂 CMP 污染物 清洗 |
英文关键词:hard disk polyether CMP particle cleaning |
基金项目:天津市重大科技攻关项目(013180311) |
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中文摘要: |
提出了硬盘在化学机械全局平整化加工(CMP)过程中污染物颗粒吸附在表面的机理,通过分析清洗中的润湿作用、分散作用、渗透作用和螯合作用,确定了清洗剂的主要成分,分析了聚醚类活性剂的特点,确定了清洗剂中各成分的最佳配比。采用该方法能够有效去除硬盘CMP后表面的污染物,达到硬盘加工的工艺要求。 |
英文摘要: |
Particle adsorption mechanism in the process of CMP has been put forwarded.The functions of wetting, dispersion, infiltration and sequestration, and the characteristics of polyether have been analyzed. Cleaner components have been confirmed by experiments, which can remove contaminants effectively and meet the requirement of hard disk processing. |
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