颜怡文,李照康,邹孟妤.电镀雾锡层锡晶须生长机制的研究[J].表面技术,2010,39(3):19-22.
YAN Yi-wen,LI Zhao-kang,ZOU Meng-yu.Sn Whisker Growth Mechanism in the Electroplating Matte Sn System[J].Surface Technology,2010,39(3):19-22 |
| 电镀雾锡层锡晶须生长机制的研究 |
| Sn Whisker Growth Mechanism in the Electroplating Matte Sn System |
| 投稿时间：2010-03-18 修订日期：2010-06-10 |
| DOI： |
| 中文关键词: 雾锡 锡晶须 拉张应力 压缩应力 |
| 英文关键词:matte Sn Sn whisker tensional stress compression stress |
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| 中文摘要: |
| 研究了电镀雾锡层锡晶须在不同时效温度下的生长情形,并以统计方式探讨了锡晶须在不同形状的基材上的生长机制。结果表明:弯曲的引脚处会产生拉张及压缩应力,在凹面区域及其两侧平面所受到的压缩应力会促进锡晶须的生长,而在凸面区域及其两侧平面所受到的拉张应力会抑制锡晶须的生长;对比采用不同热处理温度的情况,锡晶须的数量和长度皆会随着温度的升高而减少。 |
| 英文摘要: |
| Itinvestigated the Sn whisker growthin the matte Sn system under the various aging time and temperature meanwhile and systematically discussed its growth mechanism on the different shapes of the substrate. The result indicated that the tensional stress wasinduced in the convex region and the compression stress wasinduced in the concave region. Sn whisker growth was promoted by the compression stress in the concave side and was restrained by the tension stress in the convex side. According to the different heat-treatment conditions, the number and the length of the Sn whisker were decreased as increasing the aging temperature. |
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