孙刚,陈超,彭放,王江华,张美光,黄帅,牛秋林.金刚石表面电镀镍铁合金工艺研究[J].表面技术,2007,36(4):49-51.
SUN Gang,CHEN Chao,PENG Fang,WANG Jiang-hua,ZHANG Mei-guang,HUANG Shuai,NIU Qiu-Iin.Electrodeposition of Ni and Fe Alloy on Diamond Grains[J].Surface Technology,2007,36(4):49-51
金刚石表面电镀镍铁合金工艺研究
Electrodeposition of Ni and Fe Alloy on Diamond Grains
投稿时间:2007-03-13  修订日期:2007-08-10
DOI:
中文关键词:  金刚石  化学镀  电镀  镍铁合金
英文关键词:Diamond  Chemical plating  Electroplating  Ni and Fe alloy
基金项目:四川大学学生创新基金资助项目(2006L005)
作者单位
孙刚 四川大学原子与分子物理研究所,四川成都610065 
陈超 四川大学原子与分子物理研究所,四川成都610065 
彭放 四川大学原子与分子物理研究所,四川成都610065 
王江华 四川大学原子与分子物理研究所,四川成都610065 
张美光 四川大学原子与分子物理研究所,四川成都610065 
黄帅 四川大学原子与分子物理研究所,四川成都610065 
牛秋林 四川大学原子与分子物理研究所,四川成都610065 
AuthorInstitution
SUN Gang Institute of Atomic and Molecular Physics, Sichuan University, Chengdu 610065, China 
CHEN Chao Institute of Atomic and Molecular Physics, Sichuan University, Chengdu 610065, China 
PENG Fang Institute of Atomic and Molecular Physics, Sichuan University, Chengdu 610065, China 
WANG Jiang-hua Institute of Atomic and Molecular Physics, Sichuan University, Chengdu 610065, China 
ZHANG Mei-guang Institute of Atomic and Molecular Physics, Sichuan University, Chengdu 610065, China 
HUANG Shuai Institute of Atomic and Molecular Physics, Sichuan University, Chengdu 610065, China 
NIU Qiu-Iin Institute of Atomic and Molecular Physics, Sichuan University, Chengdu 610065, China 
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中文摘要:
      在金刚石表面镀一层均匀的镍铁合金镀层,以增强金刚石颗粒的物理化学性能。重点介绍了在金刚石颗粒上实现高质量镍铁合金镀层需要注意的一些问题。设计一种改进的滚镀装置,解决了传统金刚石电镀装置的弊病。在金刚石表面化学镀一层很薄的金属镍,然后利用滚镀装置并严格控制一定的工艺,在60 -70目的金刚石颗粒表面获得了一层镀层均匀、厚度达10 -200 μm、含铁量在20% - 25%的高硬度镍铁合金。试验的关键因素是要控制好温度、pH值、电流密度以及防止铁阳极污染镀液。
英文摘要:
      To improve the quality of diamond grain, a even alloy film of Ni and Fe was plated on diamond grain. Some problems about high quality alloy film of Ni and Fe was discussed. A improved plating facility was designed , which solve the disadvantage of the traditional facility for electrodepositing diamond. Firstly a very thin coating of Ni was plated on diamond grain. Then a even alloy film was achieved by the plating facility under some techniques controlled strictly. Fe content of the film is 200-/o -250-/o and the thickness is lOym t0 200ym. The key factor of this experiment is that temperature, pH value and current density should be control well. Moreover, Fe anode should be prevented from polluting the plating solution.
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