张聚国,付求涯.镀银铜粉导电胶的研究[J].表面技术,2007,36(4):28-30,36.
ZHANG Ju-guo,FU Qiu-ya.Research of Silver Plating Copper Filled Conductive Adhesive[J].Surface Technology,2007,36(4):28-30,36 |
| 镀银铜粉导电胶的研究 |
| Research of Silver Plating Copper Filled Conductive Adhesive |
| 投稿时间：2007-02-15 修订日期：2007-08-10 |
| DOI： |
| 中文关键词: 导电胶 连接强度 电阻率 镀银铜粉 |
| 英文关键词:Conductive adhesive Link strength Electrical resistivity Silver plating copper powder |
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| 中文摘要: |
| 对200目商用铜粉进行球磨处理得到2 -8 μm细片状铜粉，再进行多次化学镀银处理，得到表面银覆盖率达90%以上的一种高性能镀银铜粉。该镀银铜粉与环氧树脂、固化剂以及其它添加剂合成制得镀银铜粉导电胶，其防铜氧化效果好，电阻稳定且电阻率可迭10 -4Ω．cm级别，比银导电胶成本低，耐剪切、耐热老化效果好。试验中得到的导电胶连接强度≥12MPa，电阻率为4.8×10 -4Ω.cm，在1300C下有较高的抗氧化性能。 |
| 英文摘要: |
| A micro-flake 2-8 μm copper powder was obtained by grinding commercial copper powder. With several electroless silver plating treatments to the micro-flake copper powder, a high performance copper powder covered with more than 900-/o surface with silver was obtained. A kind of conductive adhesive consists of above copper powder, epoxy resin, curing agent and other additives was synthesized, which can prevent copper powders oxidation effectively. In addition, it has a stable resistance and electric resistance rate can attain 10-4Ω.cm. Compared with silver conductive adhesive, it has lower cost and better to bear shear and heat aging. The experiment data is link strength of conductive adhesives；12MPa. Electrical resistivity is 4. 8 xl0-4Ω.cm. The anti-oxidization is more higher at 1300C . |
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